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Publication date Communities Collections Article title Author(s) Journal/Conference
24 Feb 2026 SERC Institute of Microelectronics Backside Metal Interconnect for High Performance RF Interposer (Pending publish) Teck Guan Lim, Eva Wai Leong Ching, Sasi Kumar Tippabhotla, Huicheng Feng, Jiaqi Wu 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
24 Feb 2026 SERC Institute for Infocomm Research Cross-Domain Adaptation of Automated 3D X-Ray Defect Detection from HBM to Optical Transceivers Jie Wang, Richard Chang, Sajay Bhuvanendran Nair Gourikutty, Leong Ching Eva Wai, Yang Yu, Xulei Yang, Ramanpreet Singh Pahwa 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
3 Aug 2023 SERC Institute of Microelectronics High-Performance Amplifier Package Design for Heterogenous Integration on Si-interposer Teck Guan Lim, Lin Zho, Sasi Kumar Tippabhotla, Ji Lin, Jong Ming Chinq, Jiaqi Wu, Tang Gongyue, Eva Wai Leong Ching, Yong Chyn Ng, King Jien Chui, Wei Jia Lu, Chee Heng Goh, Sek Lin Pek, Jun Wei Agnes Loh 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
13 Mar 2023 SERC Institute of Microelectronics On-chip CO2 sensor integrated with MEMS emitter and pyroelectric detector Hong Cai, Md Hazwani Khairy, Rachel Ang, Linfang Xu, Doris Ng, Nanxi Li, Zhonghua Gu, Anmin Kong, Weiguo Chen, Wen Wei Seit, Eva Wai Leong Ching, Norhanani Jaafar, Huanhuan Wang, Landobasa Y.M. Tobing, Leh Woon Lim, Qingxin Zhang, Lennon Yao Ting Lee Silicon Photonics XVIII
10 Feb 2022 SERC Institute of Microelectronics An On-Chip 2-D DFT Accelerator Ultrasonic Wavefront for Convolutional Neural Networks Kok-Hin Teng, Salahuddin Raju, Di Zhu, Jayce Lay Keng Lim, Daniel Ssu-Han Chen, Eva Wai Leong Ching, Sharma Jaibir, Lee En-Yuan Joshua, Eldwin Jiaqiang Ng, Kevin Chai Tshun Chuan, Amit Lal 2021 IEEE USNC-URSI Radio Science Meeting (Joint with AP-S Symposium)
5 Jan 2022 SERC Institute of Microelectronics Comprehensive Study on Polymer Based Chip-to/chip Bonding for Gas Sensor Application Wen Wei Seit, Ser Choong Chong, Cai Hong, Eva Wai, Rachel Ang 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
10 Aug 2021 SERC Institute of Microelectronics FOWLP and Si-Interposer for High-Speed Photonic Packaging Lim Teck Guan, Eva Wai Leong Ching, Jong Ming Ching, Loh Woon Leng, David Ho Soon Wee, Surya Bhattacharya 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
15 Mar 2021 SERC Institute of Microelectronics Wafer-Scale Encapsulated Saw Temperature and Pressure Sensors for Harsh Environments Eldwin J. Ng, Jaibir Sharma, Eva Wai Leong Ching, Guoqiang Wu, Didier Pohl, Olivier Vancauwenberghe 2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS)
30 May 2017 SERC Institute of Microelectronics Extremely High Temperature and High Pressure (x-HTHP) Endurable SOI Device and Sensor Packaging for Harsh Environment Applications F.X. Che, Eva Wai Leong Ching, K.Y. Au 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)