Search results

Publication date Communities Collections Article title Author(s) Journal/Conference
3 Aug 2023 SERC Institute of Microelectronics Development of PMUT Array Packaging from Characterisation Prototypes to Customer Samples Dominico Giusti, Alex Gritti, Fabio Quaglia, Alessandro Stuart Savoia, Hideyuki Sandoh, Gerald Klug, Hitoshi Hoshino, Dutta Rahul, Vempati Srinivasa Rao, David Ho Soon Wee, Masatoshi Wakahara, Mark Shaw 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics 3D Stacking of Heterogeneous Chiplets on Modified FOWLP Platform with Thru-Silicon Redistribution Layer Chai Tai Chong, Lau Boon Long, Sharon Lim Pei Siang, David Ho Soon Wee, Rob van Kampen, Paul Castillou, Roberto Gaddi, Lance Barron, Mickael Renault, Jay Ko, Jonathan Hammond 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
5 Jan 2022 SERC Institute of Microelectronics Addressing the assembly challenges of Antenna-in-package Sharon Pei Siang Lim, Ser Choong Chong, David Ho Soon Wee, Wen Wei Seit, Jacob Jordan Soh, Tai Chong Chai 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Low Temperature Physical Vapour Deposited Cu Seed Layer for Temporary Bonded Wafer Substrates Abdul Hannan Yeo, Serine Soh Siew Boon, David Ho Soon Wee, Kalyn Lim Tien Shee, Wei Jun Qi, Zhang Kang, Kelvin Boh Tai Ming, Cheng Ting 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Realization of High Aspect Ratio Through Mold Interconnect (TMI) using Vertical Wire Leong Ching Wai, David Ho Soon Wee, Chong Ser Choong 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
10 Aug 2021 SERC Institute of Microelectronics FOWLP and Si-Interposer for High-Speed Photonic Packaging Lim Teck Guan, Eva Wai Leong Ching, Jong Ming Ching, Loh Woon Leng, David Ho Soon Wee, Surya Bhattacharya 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021 SERC Institute for Infocomm Research, Institute of Microelectronics Automated Void Detection in TSVs from 2D X-Ray Scans using Supervised Learning with 3D X-Ray Scans Ramanpreet Singh Pahwa, Saisubramaniam Gopalakrishnan, Huang Su, Ong Ee Ping, Haiwen Dai, David Ho Soon Wee, Ren Qin, Vempati Srinivasa Rao 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021 SERC Institute for Infocomm Research, Institute of Microelectronics Automated Attribute Measurements of Buried Package Features in 3D X-ray Images using Deep Learning Ramanpreet Singh Pahwa, Ma Tin Lay Nwe, Richard Chang, Oo Zaw Min, Wang Jie, Saisubramaniam Gopalakrishnan, David Ho Soon Wee, Ren Qin, Vempati Srinivasa Rao, Haiwen Dai, Jens Timo Neumann, Ramani Pichumani, Tom Gregorich 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
1 Aug 2013 SERC Institute of Microelectronics Development of Package-on-Package Using Embedded Wafer-Level Package Approach (Pending publish) Ser Choong Chong, David Ho Soon Wee, Vempati Srinivasa Rao, Nagendra Sekhar Vasarla IEEE Transactions on Components, Packaging and Manufacturing Technology