Search results

Publication date Communities Collections Article title Author(s) Journal/Conference
26 Jun 2024 SERC Institute of Microelectronics Process Challenges in Thin Wafers Fabrication with Double Side Hybrid Bond Pads for Chip Stacking Mishra Dileep Kumar, Vasarla Nagendra Sekhar, B.S.S. Chandra Rao, Ser Choong Chong, Vempati Srinivasa Rao 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
18 Mar 2024 SERC Institute of Microelectronics Reliability Assessment of 2.5D Module using Chip to Wafer Hybrid Bonding (Pending publish) Ser Choong Chong, Jason Au Keng Yuen, Vasarla Nagendra Sekhar, Ismael Cereno Daniel, Mishra Dileep Kumar, Vempati Srinivasa Rao 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024 SERC Institute of Microelectronics Development of Flip-Chip Packaging for Monolithic Microwave Integrated Circuit (Pending publish) Leong Ching Wai, Teck Guan Lim, Ser Choong Chong, Lin Zhou 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024 SERC Institute of Microelectronics Investigation of Void-free Chip-to-Chip Bonding Methods for CMOS-MEMS Compatibility (Pending publish) Yi Xuan Yeo, Eva Leong Ching Wai, Daniel Ssu-Han Chen, Ser Choong Chong 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024 SERC Institute of Microelectronics Development of Chip to Wafer Assembly with CuSnAg Microbump on Solder on Pad Interposer using Thermocompression and Solder Reflow (Pending publish) Jason Au Keng Yuen, Ser Choong Chong, Ismael Cereno Daniel 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024 SERC Institute for Infocomm Research Efficient and Adaptive Semantic Segmentation of HBMs using Incremental Learning Richard Chang, Namrata Thakur, Jie Wang, Yurni Li, Ser Choong Chong, Ramanpreet Singh Pahwa 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
3 Aug 2023 SERC Institute of Microelectronics Cu Damascene Process on Temporary Bonded Wafers for Thin Chip Stacking using Cu-Cu Hybrid Bonding Vasarla Nagendra Sekhar, Mishra Dileep Kumar, Prayudi Lianto, Ser Choong Chong, Vempati Srinivasa Rao 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics Development of 4 die stack module using Hybrid bonding approach Ser Choong Chong, Jason Au Keng Yuen, Vasarla Nagendra Sekhar, Ismael Cereno Daniel, Vempati Srinivasa Rao 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
5 Jan 2022 SERC Institute of Microelectronics Through Mold Via Development Using Laser Drilling Process for 3D Fan-out Wafer Level Package Hsiang-Yao Hsiao, David Soon Wee Ho, Ser Choong Chong, Tai Chong Chai, David Schutzberger, Yariv Oz, Guy Amrani 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Comprehensive Study on Polymer Based Chip-to/chip Bonding for Gas Sensor Application Wen Wei Seit, Ser Choong Chong, Cai Hong, Eva Wai, Rachel Ang 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)