Search results

Publication date Communities Collections Article title Author(s) Journal/Conference
26 Jun 2025 SERC Institute for Infocomm Research Efficient Visual Inspection Framework of High-Bandwidth Memory Bumps with Generative and Deep Learning AI Richard Chang, Jie Wang, Ser Choong Chong, Xulei Yang, Ramanpreet Singh Pahwa 2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
26 Jun 2025 SERC Institute for Infocomm Research An Efficient Data Augmentation and Semantic Segmentation Framework for 3D Defect Detection of HBMs Yang Yu, Jie Wang, Richard Chang, Ser Choong Chong, Ramanpreet Singh Pahwa, Xulei Yang 2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
7 Nov 2024 SERC Institute of Microelectronics 1.6 Tbps FOWLP-Based Silicon Photonic Engine for Co-Packaged Optics Xin Li, Sajay Bhuvanendran Nair Gourikutty, Jiaqi Wu, Teck Guan Lim, Pengfei Guo, Jaye Charles Davies, Edward Sing Chee Koh, Boon Long Lau, Ming Chinq Jong, Ser Choong Chong, San Sandra, Chao Li, Guo-Qiang Lo, Surya Bhattacharya, Jason Tsung-Yang Liow Journal of Lightwave Technology
26 Jun 2024 SERC Institute of Microelectronics Process Challenges in Thin Wafers Fabrication with Double Side Hybrid Bond Pads for Chip Stacking Mishra Dileep Kumar, Vasarla Nagendra Sekhar, B.S.S. Chandra Rao, Ser Choong Chong, Vempati Srinivasa Rao 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
18 Mar 2024 SERC Institute of Microelectronics Reliability Assessment of 2.5D Module using Chip to Wafer Hybrid Bonding Ser Choong Chong, Jason Au Keng Yuen, Vasarla Nagendra Sekhar, Ismael Cereno Daniel, Mishra Dileep Kumar, Vempati Srinivasa Rao 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024 SERC Institute of Microelectronics Development of Flip-Chip Packaging for Monolithic Microwave Integrated Circuit Leong Ching Wai, Teck Guan Lim, Ser Choong Chong, Lin Zhou 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024 SERC Institute of Microelectronics Investigation of Void-free Chip-to-Chip Bonding Methods for CMOS-MEMS Compatibility Yi Xuan Yeo, Eva Leong Ching Wai, Daniel Ssu-Han Chen, Ser Choong Chong 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024 SERC Institute of Microelectronics Development of Chip to Wafer Assembly with CuSnAg Microbump on Solder on Pad Interposer using Thermocompression and Solder Reflow Jason Au Keng Yuen, Ser Choong Chong, Ismael Cereno Daniel 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024 SERC Institute for Infocomm Research Efficient and Adaptive Semantic Segmentation of HBMs using Incremental Learning Richard Chang, Namrata Thakur, Jie Wang, Yurni Li, Ser Choong Chong, Ramanpreet Singh Pahwa 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
3 Aug 2023 SERC Institute of Microelectronics Cu Damascene Process on Temporary Bonded Wafers for Thin Chip Stacking using Cu-Cu Hybrid Bonding Vasarla Nagendra Sekhar, Mishra Dileep Kumar, Prayudi Lianto, Ser Choong Chong, Vempati Srinivasa Rao 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)