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5 Jan 2022
SERC
Institute of Microelectronics
Assembly of Miniature Nanoantenna Spatial Light Modulator
Ser Choong Chong,
Rasna Maruthiyodan Veetil,
Aarthy Mani,
Zhu Di,
Ramón Paniagua-Domínguez,
Arseniy Kuznetsov,
Vempati Srinivas
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022
SERC
Institute of Microelectronics
Addressing the assembly challenges of Antenna-in-package
Sharon Pei Siang Lim,
Ser Choong Chong,
David Ho Soon Wee,
Wen Wei Seit,
Jacob Jordan Soh,
Tai Chong Chai
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022
SERC
Institute of Microelectronics
Comprehensive Study on Polymer Based Chip-to/chip Bonding for Gas Sensor Application
Wen Wei Seit,
Ser Choong Chong,
Cai Hong,
Eva Wai,
Rachel Ang
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022
SERC
Institute of Microelectronics
Through Mold Via Development Using Laser Drilling Process for 3D Fan-out Wafer Level Package
Hsiang-Yao Hsiao,
David Soon Wee Ho,
Ser Choong Chong,
Tai Chong Chai,
David Schutzberger,
Yariv Oz,
Guy Amrani
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
10 Aug 2021
SERC
Institute of Microelectronics
Comprehensive Study of Thermal Impact on Warpage Behaviour of FOWLP with Different Die to Mold Ratio
Ser Choong Chong,
Simon Siak Boon Lim,
Wen Wei Seit,
Tai Chong Chai,
Debbie Claire Sanchez
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021
SERC
Institute of Microelectronics
Comprehensive study on Chip to wafer hybrid bonding process for fine pitch high density heterogeneous applications
Sharon Pei Siang Lim,
Ser Choong Chong,
Vivek Chidambaram
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
1 Aug 2013
SERC
Institute of Microelectronics
Development of Package-on-Package Using Embedded Wafer-Level Package Approach
(Pending publish)
Ser Choong Chong,
David Ho Soon Wee,
Vempati Srinivasa Rao,
Nagendra Sekhar Vasarla
IEEE Transactions on Components, Packaging and Manufacturing Technology
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