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26 Jun 2024
SERC
Institute of Microelectronics
Process Challenges in Thin Wafers Fabrication with Double Side Hybrid Bond Pads for Chip Stacking
Mishra Dileep Kumar,
Vasarla Nagendra Sekhar,
B.S.S. Chandra Rao,
Ser Choong Chong,
Vempati Srinivasa Rao
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
18 Mar 2024
SERC
Institute of Microelectronics
Reliability Assessment of 2.5D Module using Chip to Wafer Hybrid Bonding
Ser Choong Chong,
Jason Au Keng Yuen,
Vasarla Nagendra Sekhar,
Ismael Cereno Daniel,
Mishra Dileep Kumar,
Vempati Srinivasa Rao
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024
SERC
Institute of Microelectronics
Development of Flip-Chip Packaging for Monolithic Microwave Integrated Circuit
Leong Ching Wai,
Teck Guan Lim,
Ser Choong Chong,
Lin Zhou
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024
SERC
Institute of Microelectronics
Investigation of Void-free Chip-to-Chip Bonding Methods for CMOS-MEMS Compatibility
Yi Xuan Yeo,
Eva Leong Ching Wai,
Daniel Ssu-Han Chen,
Ser Choong Chong
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024
SERC
Institute of Microelectronics
Development of Chip to Wafer Assembly with CuSnAg Microbump on Solder on Pad Interposer using Thermocompression and Solder Reflow
Jason Au Keng Yuen,
Ser Choong Chong,
Ismael Cereno Daniel
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024
SERC
Institute for Infocomm Research
Efficient and Adaptive Semantic Segmentation of HBMs using Incremental Learning
Richard Chang,
Namrata Thakur,
Jie Wang,
Yurni Li,
Ser Choong Chong,
Ramanpreet Singh Pahwa
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
3 Aug 2023
SERC
Institute of Microelectronics
Cu Damascene Process on Temporary Bonded Wafers for Thin Chip Stacking using Cu-Cu Hybrid Bonding
Vasarla Nagendra Sekhar,
Mishra Dileep Kumar,
Prayudi Lianto,
Ser Choong Chong,
Vempati Srinivasa Rao
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023
SERC
Institute of Microelectronics
Development of 4 die stack module using Hybrid bonding approach
Ser Choong Chong,
Jason Au Keng Yuen,
Vasarla Nagendra Sekhar,
Ismael Cereno Daniel,
Vempati Srinivasa Rao
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
5 Jan 2022
SERC
Institute of Microelectronics
Through Mold Via Development Using Laser Drilling Process for 3D Fan-out Wafer Level Package
Hsiang-Yao Hsiao,
David Soon Wee Ho,
Ser Choong Chong,
Tai Chong Chai,
David Schutzberger,
Yariv Oz,
Guy Amrani
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022
SERC
Institute of Microelectronics
Comprehensive Study on Polymer Based Chip-to/chip Bonding for Gas Sensor Application
Wen Wei Seit,
Ser Choong Chong,
Cai Hong,
Eva Wai,
Rachel Ang
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
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