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Publication date Communities Collections Article title Author(s) Journal/Conference
5 Jan 2022 SERC Institute of Microelectronics Through Mold Via Development Using Laser Drilling Process for 3D Fan-out Wafer Level Package Hsiang-Yao Hsiao, David Soon Wee Ho, Ser Choong Chong, Tai Chong Chai, David Schutzberger, Yariv Oz, Guy Amrani 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Comprehensive Study on Polymer Based Chip-to/chip Bonding for Gas Sensor Application Wen Wei Seit, Ser Choong Chong, Cai Hong, Eva Wai, Rachel Ang 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Addressing the assembly challenges of Antenna-in-package Sharon Pei Siang Lim, Ser Choong Chong, David Ho Soon Wee, Wen Wei Seit, Jacob Jordan Soh, Tai Chong Chai 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Assembly of Miniature Nanoantenna Spatial Light Modulator Ser Choong Chong, Rasna Maruthiyodan Veetil, Aarthy Mani, Zhu Di, Ramón Paniagua-Domínguez, Arseniy Kuznetsov, Vempati Srinivas 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
10 Aug 2021 SERC Institute of Microelectronics Comprehensive study on Chip to wafer hybrid bonding process for fine pitch high density heterogeneous applications Sharon Pei Siang Lim, Ser Choong Chong, Vivek Chidambaram 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021 SERC Institute of Microelectronics Comprehensive Study of Thermal Impact on Warpage Behaviour of FOWLP with Different Die to Mold Ratio Ser Choong Chong, Simon Siak Boon Lim, Wen Wei Seit, Tai Chong Chai, Debbie Claire Sanchez 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
1 Aug 2013 SERC Institute of Microelectronics Development of Package-on-Package Using Embedded Wafer-Level Package Approach (Pending publish) Ser Choong Chong, David Ho Soon Wee, Vempati Srinivasa Rao, Nagendra Sekhar Vasarla IEEE Transactions on Components, Packaging and Manufacturing Technology