26 Jun 2024
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SERC
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Institute of Microelectronics
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Process Challenges in Thin Wafers Fabrication with Double Side Hybrid Bond Pads for Chip Stacking
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Mishra Dileep Kumar,
Vasarla Nagendra Sekhar,
B.S.S. Chandra Rao,
Ser Choong Chong,
Vempati Srinivasa Rao
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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18 Mar 2024
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SERC
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Institute of Microelectronics
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Reliability Assessment of 2.5D Module using Chip to Wafer Hybrid Bonding (Pending publish)
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Ser Choong Chong,
Jason Au Keng Yuen,
Vasarla Nagendra Sekhar,
Ismael Cereno Daniel,
Mishra Dileep Kumar,
Vempati Srinivasa Rao
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
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18 Mar 2024
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SERC
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Institute of Microelectronics
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Development of Flip-Chip Packaging for Monolithic Microwave Integrated Circuit (Pending publish)
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Leong Ching Wai,
Teck Guan Lim,
Ser Choong Chong,
Lin Zhou
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
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18 Mar 2024
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SERC
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Institute of Microelectronics
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Investigation of Void-free Chip-to-Chip Bonding Methods for CMOS-MEMS Compatibility (Pending publish)
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Yi Xuan Yeo,
Eva Leong Ching Wai,
Daniel Ssu-Han Chen,
Ser Choong Chong
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
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18 Mar 2024
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SERC
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Institute of Microelectronics
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Development of Chip to Wafer Assembly with CuSnAg Microbump on Solder on Pad Interposer using Thermocompression and Solder Reflow (Pending publish)
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Jason Au Keng Yuen,
Ser Choong Chong,
Ismael Cereno Daniel
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
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18 Mar 2024
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SERC
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Institute for Infocomm Research
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Efficient and Adaptive Semantic Segmentation of HBMs using Incremental Learning
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Richard Chang,
Namrata Thakur,
Jie Wang,
Yurni Li,
Ser Choong Chong,
Ramanpreet Singh Pahwa
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
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3 Aug 2023
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SERC
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Institute of Microelectronics
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Cu Damascene Process on Temporary Bonded Wafers for Thin Chip Stacking using Cu-Cu Hybrid Bonding
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Vasarla Nagendra Sekhar,
Mishra Dileep Kumar,
Prayudi Lianto,
Ser Choong Chong,
Vempati Srinivasa Rao
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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3 Aug 2023
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SERC
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Institute of Microelectronics
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Development of 4 die stack module using Hybrid bonding approach
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Ser Choong Chong,
Jason Au Keng Yuen,
Vasarla Nagendra Sekhar,
Ismael Cereno Daniel,
Vempati Srinivasa Rao
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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5 Jan 2022
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SERC
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Institute of Microelectronics
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Through Mold Via Development Using Laser Drilling Process for 3D Fan-out Wafer Level Package
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Hsiang-Yao Hsiao,
David Soon Wee Ho,
Ser Choong Chong,
Tai Chong Chai,
David Schutzberger,
Yariv Oz,
Guy Amrani
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2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
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5 Jan 2022
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SERC
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Institute of Microelectronics
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Comprehensive Study on Polymer Based Chip-to/chip Bonding for Gas Sensor Application
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Wen Wei Seit,
Ser Choong Chong,
Cai Hong,
Eva Wai,
Rachel Ang
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2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
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