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Publication date Communities Collections Article title Author(s) Journal/Conference
18 Mar 2024 SERC Institute of Microelectronics Wafer Level Fabrication of Embedded Silicon Microcooler on Heating Devices (Pending publish) Lau Boon Long, Javier Ong, Jason Au, Jong Ming Chinq, Zhang Xiaowu, Feng Huicheng 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024 SERC Institute of Microelectronics Parasitic Surface Conduction Effect of TSV on Interconnection Performance in RF SOI for 2.5D Integration (Pending publish) Zhou Lin, Lim Teck Guan, Wu Jiaqi, Xu Feng, Jong Ming Chinq, Ng Yong Chyn 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
3 Aug 2023 SERC Institute of Microelectronics High-Performance Amplifier Package Design for Heterogenous Integration on Si-interposer Teck Guan Lim, Lin Zho, Sasi Kumar Tippabhotla, Ji Lin, Jong Ming Chinq, Jiaqi Wu, Tang Gongyue, Eva Wai Leong Ching, Yong Chyn Ng, King Jien Chui, Wei Jia Lu, Chee Heng Goh, Sek Lin Pek, Jun Wei Agnes Loh 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
5 Jan 2022 SERC Institute of Microelectronics High Density Redistribution Layers (< 2 µm L/S) for Chiplets Packaging Soon Wee Ho, Chockanathan Vinoth Kanna, Jong Ming Chinq, Chai Tai Chong 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)