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Publication date Communities Collections Article title Author(s) Journal/Conference
10 Feb 2022 SERC Institute of Microelectronics An On-Chip 2-D DFT Accelerator Ultrasonic Wavefront for Convolutional Neural Networks Kok-Hin Teng, Salahuddin Raju, Di Zhu, Jayce Lay Keng Lim, Daniel Ssu-Han Chen, Eva Wai Leong Ching, Sharma Jaibir, Lee En-Yuan Joshua, Eldwin Jiaqiang Ng, Kevin Chai Tshun Chuan, Amit Lal 2021 IEEE USNC-URSI Radio Science Meeting (Joint with AP-S Symposium)
10 Aug 2021 SERC Institute of Microelectronics FOWLP and Si-Interposer for High-Speed Photonic Packaging Lim Teck Guan, Eva Wai Leong Ching, Jong Ming Ching, Loh Woon Leng, David Ho Soon Wee, Surya Bhattacharya 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
15 Mar 2021 SERC Institute of Microelectronics Wafer-Scale Encapsulated Saw Temperature and Pressure Sensors for Harsh Environments Eldwin J. Ng, Jaibir Sharma, Eva Wai Leong Ching, Guoqiang Wu, Didier Pohl, Olivier Vancauwenberghe 2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS)
30 May 2017 SERC Institute of Microelectronics Extremely High Temperature and High Pressure (x-HTHP) Endurable SOI Device and Sensor Packaging for Harsh Environment Applications F.X. Che, Eva Wai Leong Ching, K.Y. Au 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)