| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 30 May 2017 | SERC | Institute of Microelectronics | Extremely High Temperature and High Pressure (x-HTHP) Endurable SOI Device and Sensor Packaging for Harsh Environment Applications | F.X. Che, Eva Wai Leong Ching, K.Y. Au | 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) |
| 30 May 2017 | SERC | Institute of Microelectronics | Co-design for Low Warpage and High Reliability in Advanced Package yvith TSVFree Interposer (TFI) | S. Bhattacharya, F.X. Che, M.Z. Ding, Y. Han | 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) |