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5 Jan 2022
SERC
Institute of Microelectronics
Towards Heterogeneous Integrated Electronic-Photonic Packages for Hyperscale Data Centers
Sajay Bhuvanendran Nair Gourikutty,
Ming Chinq Jong,
Chockanathan Vinoth Kanna,
David Soon Wee Ho,
Jiaqi Wu,
Rathin Mandal,
Nanxi Li,
Teck Guan Lim,
Jason Tsung-Yang Liow,
Surya Bhattacharya
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
10 Aug 2021
SERC
Institute of Microelectronics
Heterogeneous Integration with Embedded Fine Interconnect
Chai Tai Chong,
Lim Teck Guan,
David Ho,
Han Yong,
Chong Ser Choong,
Sharon Lim Pei Siang,
Surya Bhattacharya
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021
SERC
Institute of Microelectronics
FOWLP and Si-Interposer for High-Speed Photonic Packaging
Lim Teck Guan,
Eva Wai Leong Ching,
Jong Ming Ching,
Loh Woon Leng,
David Ho Soon Wee,
Surya Bhattacharya
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021
SERC
Institute for Infocomm Research
FOWLP AiP Optimization for Automotive Radar Applications
Mei Sun,
Teck Guan Lim,
Tai Chong Chai,
Surya Bhattacharya,
Yugang Ma
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021
SERC
Institute of Microelectronics
Case studies of accurate fault localization in advanced packages
Sajay Bhuvanendran Nair Gourikutty,
Jesse Alton,
Desmond Yeo,
Kok Keng Chua,
Sharon Lim Seow Huang,
Surya Bhattacharya
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
5 Jul 2018
SERC
Institute of Microelectronics
100 Gbps (4 × 25 Gbps) Optical Receiver Module Packaged in Chip-on-Board Based on Germanium Photodetector
Raja M. Kumarasamy,
Jason Tsung Yang Liow,
Do-Won Kim,
Andy Eu Jin Lim,
Vishal Vinayak Kulkarni,
Surya Bhattacharya,
Guo Qiang Lo
Procedia Engineering
1 Nov 2017
SERC
Institute of Microelectronics
Study on Low Warpage and High Reliability for Large Package Using TSV-Free Interposer Technology Through SMART Codesign Modeling
Mian Zhi Ding,
Yong Han,
Surya Bhattacharya,
Fa Xing Che,
Masaya Kawano
IEEE Transactions on Components, Packaging and Manufacturing Technology
15 Feb 2016
SERC
Institute of Microelectronics
An Analytical Capacitance Model for Through Silicon Vias (TSVs) in Floating Silicon Substrate
Ka Fai Chang,
Jun Zhou,
Surya Bhattacharya,
Roshan Weerasekera,
Guruprasad Katti,
Rahul Dutta,
Songbai Zhang
IEEE TRANSACTION ON ELECTRON DEVICES
1 Aug 2015
SERC
Institute of Microelectronics
Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC–TSI)
Guruprasad Katti,
David Soon Wee Ho,
Hong Yu Li,
Rahul Dutta,
Roshan Weerasekera,
Ka Fai Chang,
Jong-Kai Lin,
Vempati Srinivasa Rao,
Surya Bhattacharya
IEEE Design & Test
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