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10 Aug 2021 SERC Institute of Microelectronics FOWLP and Si-Interposer for High-Speed Photonic Packaging Lim Teck Guan, Eva Wai Leong Ching, Jong Ming Ching, Loh Woon Leng, David Ho Soon Wee, Surya Bhattacharya 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)