Institute of Microelectronics

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Publication date Article title Author(s)
7 Jun 2026 Fully Al-based 0.25 μm 20 V GaN-on-Si Process with 3 W/mm for FR3 Hsien Shun Wu, Yuan Gao, Qingyun Xie, Yi Heng Leong, Wee Leng Ong, Lakshmi Kanta Bera, Navab Singh, Geok Ing Ng
25 May 2026 Multimode GaN Transistors with Ultrawide Threshold Voltage Control Enabled by Passivation-Induced Stress–Strain–Polarization Coupling Siyu Liu, Yihao Zhuang, Pengju Cui, Qingyun Xie, Hanchao Li, Hui Teng Tan, Hanlin Xie, Lifei Xi, Chris Boothroyd, Geok Ing Ng
6 May 2026 CMOS-Compatible 200 mm 0.25 µm GaN-on-Si HEMT Process for FR3 Application Qingyun Xie, Yuan Gao, Hsien-Shun Wu, Yi Heng Leong, Hanlin Xie, Haorui Luo, Hui Teng Tan, Zhan Jiang Quek, Wee Leng Ong, Lakshmi Kanta Bera, Navab Singh, Geok Ing Ng
30 Mar 2026 GaN-on-Si HEMTs for Low Voltage FR2 Applications Enabled by Reactive-Sputtered n++-GaN Ohmic Contacts Yihao Zhuang, Siyu Liu, Qingyun Xie, Hanlin Xie, Tomita Kazuyoshi, Tetsu Kachi, Hiroshi Amano, Subramaniam Arulkumaran, Geok Ing Ng
20 Mar 2026 High Efficiency Terahertz Beam Steering Metasurfaces Using Vanadium Dioxide-Based Cross-Polarization Converters Li Mengyao, Gu Zhonghua, Saurav Prakash, Ariando Ariando, Prakash Pitchappa
10 Mar 2026 Inelastic-stress-induced threshold instability and mobility degradation in AlN/GaN MIS-HEMTs on Si Siyu Liu, Yihao Zhuang, Pengju Cui, Qingyun Xie, Hanlin Xie, Geok Ing Ng
10 Mar 2026 Thermo-optic control of a topological boundary mode Byoung-Uk Sohn, Hongwei Gao, Xavier X. Chia, Ju Won Choi, Doris K. T. Ng, Dawn T. H. Tan
9 Mar 2026 Role of structural asymmetry in tailoring electromagnetically induced transparency and figure of merit in terahertz metamaterials Dheeshna Nadukandi Purayil, Namitha Nandakumar, Sutopa Modak, Prakash Pitchappa, Abhishek Kumar
6 Mar 2026 Enhancing Thermal Uniformity in Liquid-Cooled Inverters: Adjoint-Based Optimization of a Manifold Microchannel Coldplate Bin He, Gongyue Tang
5 Mar 2026 Flip chip interconnects for quantum computing application: a comparison between tin-silver and indium bump Norhanani Binte Jaafar, Daniel Lau, Hongyu Li, Yong Chyn Ng, Ya-Ching Tseng