Institute of Microelectronics

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Publication date Article title Author(s)
18 Feb 2026 Annealing and passivation study of germanium on silicon (GOS) mid-infrared waveguide for sensing applications Rachel C. F. Ang, Jia Sheng Goh, Landobasa Y. M. Tobing, Leh Woon Lim, Amy S. K. Tong, Andrew W. K. Fong, Zhixian Chen, Doris K. T. Ng
12 Nov 2025 Robust transport of high-speed data in a topological valley Hall insulator Byoung-Uk Sohn, George F. R. Chen, Hongwei Gao, Doris K. T. Ng, Dawn T. H. Tan
12 Nov 2025 Two-phase Liquid Cooling of Vertically Stacked High-Power Chips with Backside-Embedded Micro-Pin Fins Huicheng Feng, Gongyue Tang, Xiaowu Zhang, Boon Long Lau, Ming Chinq Jong
20 Oct 2025 Contrast-Enhanced PMUT-Based Weighted Frequency Image Compounding Mantalena Sarafianou, Yu Feng Thien, David Sze Wai Choong, Liu Jihang, Yul Koh, Alberto Leotti, Fabrizio Cerini, Young Jik Hur
20 Oct 2025 High-Precision Airborne Rangefinding with PMUTs Based on Signal Spatial Coherence Mantalena Sarafianou, Yu Feng Thien, David Sze Wai Choong, Duan Jian Goh, Liu Jihang, Yul Koh, Alberto Leotti, Fabrizio Cerini, Annachiara Esposito
1 Oct 2025 Beam and Cantilever Supported PMUTs for Enhanced Transmit Sensitivity and Linearity Shyam Trivedi, Duan Jian Goh, Prakasha Chigahalli Ramegowda, Jihang Liu, Yong Shun Teo, Hong Yan, Ravi Shankar, Naadaa Ghulaam Zakiyyan, Amal Das, Carla Lazzari, Alberto Leotti, Yul Koh
23 Sep 2025 High‐Asymmetry Metasurface: A New Solution for Terahertz Resonance via Active Learning‐Augmented Diffusion Model Qiqi Dai, Yinpeng Wang, Cheng Xu, Dongxiao Li, Prakash Pitchappa, Thomas Caiwei Tan, Ranjan Singh, Chengkuo Lee
4 Sep 2025 Investigation of coolant-dependent thermal performance in backside-embedded micro-pin fin arrays for high-power microelectronics cooling Huicheng Feng, Gongyue Tang, Xiaowu Zhang
27 Jun 2025 A Digital Compute-in-Memory Macro Featuring Two’s Complement Multiplication for LSTM-based Biomedical Signal Classification Jinhai Hu, Wang Ling Goh, Yuan Gao
26 Jun 2025 Thermal Characterization of HBMs Integrated via Hybrid Bonding Huicheng Feng, Yong Han, Gongyue Tang, Ling Xie, Vasarla Nagendra Sekhar