Institute of Microelectronics

Publication date Article title Author(s)
17 Aug 2020 Considerations for an 8-inch Wafer-level CMOS compatible AlN Pyroelectric 5-14 um wavelength IR detector towards miniature integrated photonics gas sensors Doris K. T. Ng, Guoqiang Wu, Tan-Tan Zhang, Linfang Xu, Jianbo Sun, Wing-Wai Chung, Hong Cai, Qingxin Zhang, Navab Singh
29 Jul 2020 Area Efficient High Through-put Dual Heavy Metal Multi-Level Cell SOT-MRAM Karim Ali, Fei Li, S. Y. H. Lua, Chun-Huat Heng
22 Apr 2020 Large-area metasurface on CMOS-compatible fabrication platform: Driving flat optics from lab to fab Nanxi Li, Zhengji Xu, Yuan Dong, Ting Hu, Qize Zhong, Yuan Hsing Fu, Shiyang Zhu, Navab Singh
13 Apr 2020 A Dynamic Control System for Server Processor Direct Liquid Cooling Haoran Chen, Yong Han, Gongyue Tang, Xiaowu Zhang
10 Apr 2020 A Performance Study of Dielectric Metalens with Process-Induced Defects Yanyan Zhou, Ting Hu, Yu Li, Nanxi Li, Yuan Dong, Dongdong Li, Yuan Hsing Fu, Qize Zhong, Zhengji Xu, Shiyang Zhu, Qunying Lin, Navab Singh
8 Apr 2020 Frequency-Agile Temporal Terahertz Metamaterials Prakash Pitchappa, Abhishek Kumar, Haidong Liang, Saurav Prakash, Nan Wang, Andrew A Bettiol, Thirumalai Venkatesan, Chengkuo Lee, Ranjan Singh
1 Oct 2019 A 0.034% Charge-Imbalanced Neural Stimulation Front-End (SFE) IC with On-Chip Voltage Compliance Monitoring Circuit and Analysis on Resting Potential by Utilizing the SFE IC Yong-Joon Jeon, Lei Yao, Yuan Gao, Annamalai Arasu Muthukumaraswamy
23 Sep 2019 Analog switching characteristics in TiW/ Al2O3/Ta2O5/Ta RRAM devices Wendong Song, Weijie Wang, Hock Koon Lee, Minghua Li, Victor Zhuo, Zhixian Chen, King Jien Chui, Jen-Chieh Liu, I-Ting Wang, Yao Zhu, Navab Singh
23 Sep 2019 Analog switching characteristics in TiW/Al2O3/Ta2O5/Ta RRAM devices Wendong Song, Weijie Wang, Hock Koon Lee, Minghua Li, Victor Yi-Qian Zhuo, Zhixian Chen, King Jien Chui, Jen-Chieh Liu, I.-Ting Wang, Yao Zhu, Navab Singh
17 Sep 2019 Large-area pixelated metasurface beam deflector on a 12-inch glass wafer for random point generation Nanxi Li, Yuan Hsing Fu, Yuan Dong, Ting Hu, Zhengji Xu, Qize Zhong, Dongdong Li, Keng Heng Lai, Shiyang Zhu, Qunying Lin, Yuandong Gu, Navab Singh
3 Sep 2019 Enabling Neuromorphic Computing: BEOL Integration of CMOS RRAM Chip and Programmable Performance Weijie Wang, Victor Yi-Qian Zhuo, Zhixian Chen, Hock Koon Lee, Minghua Li, Wendong Song
28 Aug 2019 CMOS-compatible all-Si metasurface polarizing bandpass filters on 12-inch wafers Zhengji Xu, Yuan Dong, Chih-Kuo Tseng, Ting Hu, Jinchao Tong, Qize Zhong, Nanxi Li, Larry Sim, Keng Heng Lai, Ying Lin, Dongdong Li, Yu Li, Bliznetsov Vladimir, Yuan-Hsing Fu, Shiyang Zhu, Qunying Lin, Dao Hua Zhang, Yuandong Gu, Navab Singh, Dim-Lee Kwong
8 Aug 2019 Si Microfluid Cooler With Jet-Slot Array for Server Processor Direct Liquid Cooling Yong Han, Boon Long Lau, Gongyue Tang, Haoran Chen, Xiaowu Zhang
19 Jul 2019 Hermetic Sealant Material Possibilities for IR Sensor Packaging Vivek Chidambaram, Lin Bu, Kai Liang Chuan
1 Jun 2019 Over 10% of k2eff Demonstrated by 2-GHz Spurious Mode-Free Sc0.12Al0.88N Laterally Coupled Alternating Thickness Mode Resonators Nan Wang, Yao Zhu, Geng Li Chua, Bangtao Chen, Srinivas Merugu, Navab Singh, Yuandong Gu
28 May 2019 Microring resonator-assisted Fourier transform spectrometer with enhanced resolution and large bandwidth in single chip solution S. N. Zheng, J. Zou, H. Cai, J. F. Song, L. K. Chin, P. Y. Liu, Z. P. Lin, D. L. Kwong, A. Q. Liu
17 May 2019 Ultracompact Multielectrode Array for Neurological Monitoring Ming-Yuan Cheng, Ramona B. Damalerio, Weiguo Chen, Ramamoorthy Rajkumar, Gavin S. Dawe
1 May 2019 Thermal Optimization and Characterization of SiC-Based High Power Electronics Packages With Advanced Thermal Design Gongyue Tang, Tai Chong Chai, Xiaowu Zhang
12 Dec 2018 Adipose-on-a-chip: a dynamic microphysiological in vitro model of the human adipose for immune-metabolic analysis in type II diabetes Yunxiao Liu, Patthara Kongsuphol, Su Yin Chiam, Qing Xin Zhang, Sajay Bhuvanendran Nair Gourikutty, Shilpi Saha, Subhra Kumar Biswas, Qasem Ramadan
1 Sep 2018 Cost-Effective Testing Solutions for Sealing Material with IR Package Bu Lin, Jason Keng Yuen Au, Mian Zhi Ding, Vivek Chidambaram, Foo Wing Ng
23 Jul 2018 Demonstration of color display metasurfaces via immersion lithography on a 12-inch silicon wafer Ting Hu, Chih-Kuo Tseng, Yuan Hsing Fu, Zhengji Xu, Yuan Dong, Shijie Wang, Keng Heng Lai, Vladimir Bliznetsov, Shiyang Zu, Qunying Lin, Yuandong Gu
5 Jul 2018 100 Gbps (4 × 25 Gbps) Optical Receiver Module Packaged in Chip-on-Board Based on Germanium Photodetector Raja M. Kumarasamy, Jason Tsung Yang Liow, Do-Won Kim, Andy Eu Jin Lim, Vishal Vinayak Kulkarni, Surya Bhattacharya, Guo Qiang Lo
1 Jul 2018 Compact Low Loss Mid-Infrared Wavelength-Flattened Directional Coupler (WFDC) for Arbitrary Power Splitting Ratio Enabled by Rib Waveguide Dispersion Engineering Bowei Dong, Xianshu Luo, Ting Hu, Tina Xin Guo, Hong Wang, Dim-Lee Kwong, Patrick Guo-Qiang Lo, Chengkuo Lee
1 Apr 2018 Wafer-Level Vacuum-Packaged High Performance AlN-on-SOI Piezoelectric Resonator for Sub-100 MHz Oscillator Applications Guoqiang Wu, Jinghui Xu, Xiaolin Zhang, Nan Wang, Danlei Yan, Jayce Lay Keng Lim, Yao Zhu, Wei Li, Yuandong Gu
21 Mar 2018 High-density impedance-sensing array on complementary metal-oxide-semiconductor circuitry assisted by negative dielectrophoresis for single-cell-resolution measurement Jaehoon Chung, Yu Chen, Seong-Jin Kim
1 Nov 2017 Study on Low Warpage and High Reliability for Large Package Using TSV-Free Interposer Technology Through SMART Codesign Modeling Mian Zhi Ding, Yong Han, Surya Bhattacharya, Fa Xing Che, Masaya Kawano
31 Oct 2017 Polymer coated silicon microring device for the detection of sub-ppm volatile organic compounds Dongliang Fu, Jaehoon Chung, Qing Liu, Riazul Raziq, Jack Sheng Kee, Mi Kyoung Park, Suresh Valiyaveettil, Pyng Lee
3 Oct 2017 MEMS Industry-Worth Etching to Fabricate Tapered Structures in SiO2 Vladimir Bliznetsov, Bin Li, Jae Wung Lee, Huamao Lin
1 Oct 2017 ScAlN-based LCAT Mode Resonators Above 2 GHz with High FOM and Reduced Fabrication Complexity Yao Zhu, Nan Wang, Gengli Chua, Chengliang Sun, Navab Singh, Yuandong Gu
12 Sep 2017 Torsional frequency mixing and sensing in optomechanical resonators Jian Guo Huang, Hong Cai, Alex Yuan Dong Gu, Lip Ket Chin, Jiu Hui Wu, Tian Ning Chen, Zheng Chuan Yang, Yi Long Hao, Ai Qun Liu
30 Aug 2017 Label-free, real-time and multiplex detection of Mycobacteriumtuberculosis based on silicon photonic microring sensors andasymmetric isothermal amplification technique (SPMS-AIA) Qing Liu, Boon Kiat Lennon Lim, Lim Swee Yin, Wen Ying Tang, Zhong Hua Gu, Jaehoon Chung, Mi Kyoung Park, Timonthy Barkham
1 Aug 2017 Dual MEMS Resonator Structure for Temperature Sensor Applications Humberto Campanella, Margarita Narducci, Merugu Srinivas, Navab Singh
18 Jul 2017 Microfluidic packaging of high-density CMOS electrode array for lab-on-a-chip applications Jaehoon Chung, How Yuan Hwang, Yu Chen, Tae Yoon Lee
1 Jun 2017 Silicon-on-Insulator Waveguide Devices for Broadband Mid-Infrared Photonics Bowei Dong, Xin Guo, Chong Pei Ho, Bo Li, Hong Wang, Chengkuo Lee, Xianshu Luo, Guo-Qiang Lo
30 May 2017 Biopackaging of minimally invasive ultrasound assisted clot lysis device for stroke treatment Ming-Yuan Cheng, Weiguo Chen, Ramona Damalerio, Liang Lou, Songsong Zhang
30 May 2017 Simulation Analysis of a Conformal Patch Sensor for Skin Tension and Swelling Detection Ming-Yuan Cheng, Ramona Damalerio, Weiguo Chen, Ruiqi Lim
30 May 2017 Thin-film Magnetic Inductors for Integrated Power Management Jun Yu, Serine Soh, Muthukumaraswamy Annamalai Arasu, King Jien Chui, Wei Yi Lim, Sunil Wickramanayaka, Yew Wing Leong, Huamao Lin
30 May 2017 Co-design for Low Warpage and High Reliability in Advanced Package yvith TSVFree Interposer (TFI) S. Bhattacharya, F.X. Che, M.Z. Ding, Y. Han
30 May 2017 Wafer-Level Vacuum-Packaged Piezoelectric Energy Harvesters Utilizing Two-Step Three-Wafer Bonding Qingxin Zhang, Yuandong Gu, Nan Wang, Li Yan Siow, Lionel You Liang Wong, Chengliang Sun, Hongmiao Ji, Darmayuda I Made, Peter Chang
30 May 2017 Electrical Characterization of CMP-less Via-Last TSV under Reliability Stress Conditions King-Jien Chui, Mingbin Yu
30 May 2017 A Novel Method for Air-gap Formation around Via-Middle (VM) TSVs for Effective Reduction in Keep-Out Zones (KOZ) Woon Leng Loh, Xiangyu Wang, Zhaohui Chen, Mingbin Yu, King-Jien Chui
30 May 2017 Passive Devices Fabrication on FOWLP and Characterization for RF Applications Chunmei Wang, King Jien Chui, Xiangyu Wang, Teck Guan Lim, Mingbin Yu, Gilbert See, Gu Yu
30 May 2017 Stealth Dicing Challenges for MEMS Wafer Applications Daniel Ismael Cereno, Sunil Wickramanayaka
30 May 2017 Development of TSV electroplating process for via-last technology Gilho Hwang, Ravanethran Kalaiselvan
30 May 2017 Package-level Si Micro-fluid Cooler with Enhanced Jet Array for High Performance 3D Systems Yong Han, Boon Long Lau, Gongyue Tang, Seow Meng Low, Jason Goh
30 May 2017 Extremely High Temperature and High Pressure (x-HTHP) Endurable SOI Device and Sensor Packaging for Harsh Environment Applications F.X. Che, Eva Wai Leong Ching, K.Y. Au
30 May 2017 High Vacuum and High Robustness Al-Ge Bonding for Wafer Level Chip Scale Packaging of MEMS Sensors Jinghui Xu, Zhipeng Ding, Vivek Chidambaram, Hongmiao Ji, Yuandong Gu
30 May 2017 Forming a vertical interconnect structure using dry film processing for Fan Out Wafer Level Packaging Yew Wing Leong, Hsiang-Yao Hsiao, David Soon Wee Ho, Boon Long Lau, Huamao Lin
30 May 2017 Process and Reliability of Large Fan-Out Wafer Level Package based Package-on-Package Sharon PS Lim, Daniel Ismael, Ye Yong Liang, Vempati Srinivasa Rao, Chai Tai Chong, David Ho, Ding Mian Zhi, Chong Ser Choong
30 May 2017 High-band AlN Based RF-MEMS Resonator for TSV integration Srinivas Merugu, Mingbin Yu, Gengli Chua, Nan Wang, Yao Zhu, Chengliang Sun