B. He and G. Tang, "Enhancing Thermal Uniformity in Liquid-Cooled Inverters: Adjoint-Based Optimization of a Manifold Microchannel Coldplate," in IEEE Transactions on Components, Packaging and Manufacturing Technology, doi: 10.1109/TCPMT.2026.3670867.
Abstract:
Power electronics inverters are a cornerstone of modern electric vehicle systems, where thermal management has emerged as a key barrier to achieving ambitious power density targets. This study addresses the critical issue of thermal non-uniformity in liquid-cooled inverters containing multiple discrete chips by optimizing coolant flow distribution. A cost-effective thermal test vehicle (TTV) was developed, utilizing stacked platinum ceramic heaters to accurately simulate the thermal behavior of a commercial inverter. Initial experiments with a baseline cooling manifold revealed a significant flow imbalance, resulting in chip-to-chip temperature variations of up to 3.7°C. An adjoint-based shape optimization methodology was employed to redesign the manifold geometry for superior flow uniformity. Experimental validation of the optimized design, tested across three distinct microchannel configurations, confirmed a substantial improvement in thermal performance. The maximum chip-to-chip temperature difference was reduced to approximately 1°C while maintaining high cooling effectiveness and reducing pumping power by 3.4-9.9%. The optimized system demonstrates a viable and manufacturable path toward high-performance thermal management in compact, power-dense inverter designs.
License type:
Publisher Copyright
Funding Info:
This research / project is supported by the A*STAR - RIE2025 Manufacturing, Trade, and Connectivity Industry Alignment Fund - Development of High Performance Electric Traction Module (HiPe-ETraM)
Grant Reference no. : M22K4a0044