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Publication date Communities Collections Article title Author(s) Journal/Conference
12 Nov 2025 SERC Institute of Microelectronics Two-phase Liquid Cooling of Vertically Stacked High-Power Chips with Backside-Embedded Micro-Pin Fins Huicheng Feng, Gongyue Tang, Xiaowu Zhang, Boon Long Lau, Ming Chinq Jong IEEE Transactions on Components, Packaging and Manufacturing Technology
4 Sep 2025 SERC Institute of Microelectronics Investigation of coolant-dependent thermal performance in backside-embedded micro-pin fin arrays for high-power microelectronics cooling Huicheng Feng, Gongyue Tang, Xiaowu Zhang International Journal of Thermal Sciences
26 Jun 2025 SERC Institute of Microelectronics Thermal Characterization of HBMs Integrated via Hybrid Bonding Huicheng Feng, Yong Han, Gongyue Tang, Ling Xie, Vasarla Nagendra Sekhar 2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
11 Mar 2025 SERC Institute of Microelectronics Assembly of Multi-Device Power Package with Clips as Interconnects Leong Ching Wai, Yi Xuan Yeo, Jacob Jordan Soh, Gongyue Tang 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)
11 Mar 2025 SERC Institute of Microelectronics Thermal Design and Analysis of a Flip-Chip GaN-on-SiC HEMT Huicheng Feng, Lin Zhou, Gongyue Tang, Leong Ching Wai, Teck Guan Lim 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)
26 Jun 2024 SERC Institute of Microelectronics Embedded Liquid Cooling of High-Power Microelectronics Using Liquid Metal Huicheng Feng, Bin He, Gongyue Tang, Xiaowu Zhang, Boon Long Lau, Keng Yuen Jason Au, Jun Wei Javier Ong, Ming Chinq Jong 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
18 Mar 2024 SERC Institute of Microelectronics Transient Thermal Characterization and Analysis for Next Generation SiC Power Module Gongyue Tang, Yong Liang Ye, Leong Ching Wai, Yong Han 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
28 Feb 2024 SERC Institute of Microelectronics Two-Phase Liquid Cooling for High-Power Microelectronics via Embedded Micro-Pin Fin Heat Sink Huicheng Feng, Gongyue Tang, Xiaowu Zhang, Boon Long Lau, Ming Chinq Jong, Keng Yuen Jason Au, Jun Wei Javier Ong, King Jien Chui, Jun LI, Hongying Li, Duc Vinh Le, Jing Lou IEEE Transactions on Components, Packaging and Manufacturing Technology
3 Aug 2023 SERC Institute of Microelectronics Thermal Characterization and Management of GaN-on-SiC High Power Amplifier MMIC Yong Han, Gongyue Tang, Boon Long Lau 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics Development and Demonstration of a Novel Immersion Two Phase Cooling High Power SiC Power Module Gongyue Tang, Leong Ching Wai, Huicheng Feng 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)