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Publication date Communities Collections Article title Author(s) Journal/Conference
5 Jan 2022 SERC Institute of Microelectronics Numerical investigation of the optimization on manifold microchannel heat sink towards the water-cooling limit Haoran Chen, Yong Han, Gongyue Tang 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
10 Aug 2021 SERC Institute of Microelectronics Development of a Novel Lead Frame Based Double Side Liquid Cooling High Performance SiC Power Module Gongyue Tang, Leong Ching Wai, Siak Boon Lim, Yong Liang Ye, Boon Long Lau, Kazunori Yamamoto, Xiaowu Zhang 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
13 Apr 2020 SERC Institute of Microelectronics A Dynamic Control System for Server Processor Direct Liquid Cooling Haoran Chen, Yong Han, Gongyue Tang, Xiaowu Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology
8 Aug 2019 SERC Institute of Microelectronics Si Microfluid Cooler With Jet-Slot Array for Server Processor Direct Liquid Cooling Yong Han, Boon Long Lau, Gongyue Tang, Haoran Chen, Xiaowu Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology
1 May 2019 SERC Institute of Microelectronics Thermal Optimization and Characterization of SiC-Based High Power Electronics Packages With Advanced Thermal Design Gongyue Tang, Tai Chong Chai, Xiaowu Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology
30 May 2017 SERC Institute of Microelectronics Package-level Si Micro-fluid Cooler with Enhanced Jet Array for High Performance 3D Systems Yong Han, Boon Long Lau, Gongyue Tang, Seow Meng Low, Jason Goh 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
1 Jan 2017 SERC Institute of Microelectronics Si-Based Hybrid Microcooler With Multiple Drainage Microtrenches for High Heat Flux Cooling Yong Han, Boon Long Lau, Gongyue Tang, Xiaowu Zhang, Min Woo Rhee IEEE Transactions on Components, Packaging and Manufacturing Technology
7 Apr 2016 SERC Institute of Microelectronics Development of a Compact and Efficient Liquid Cooling System With Silicon Microcooler for High-Power Microelectronic Devices Gongyue Tang, Boon Long Lau, Xiaowu Zhang, Daniel Min Woo Rhee IEEE Transactions on Components, Packaging and Manufacturing Technology
8 Dec 2015 SERC Institute of Microelectronics Thermal Management of Hotspots Using Diamond Heat Spreader on Si Microcooler for GaN Devices Yong Han, Boon Long Lau, Gongyue Tang, Xiaowu Zhang Components, Packaging and Manufacturing Technology, IEEE Transactions on