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Publication date Communities Collections Article title Author(s) Journal/Conference
17 Jun 2026 SERC Institute of Microelectronics Liquid Metal Cooling for High-Power Electronics Driven by Magnetohydrodynamic Effect Huicheng Feng, Bin He, Gongyue Tang, Xiaowu Zhang, Wei Kin Tan 2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
17 Jun 2026 SERC Institute of Microelectronics Process Development of Two-Stacked Chips with a Backside Embedded Two-Phase Cooling Solution Xiaowu Zhang, Boon Long Lau, Huicheng Feng, Gongyue Tang, Ming Chinq Jong, Surya Bhattacharya, Vempati Srinivasa Rao, B.S.S. Chandra Rao, Tran Van Nhat Anh 2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
6 Mar 2026 SERC Institute of Microelectronics Enhancing Thermal Uniformity in Liquid-Cooled Inverters: Adjoint-Based Optimization of a Manifold Microchannel Coldplate Bin He, Gongyue Tang IEEE Transactions on Components, Packaging and Manufacturing Technology
24 Feb 2026 SERC Institute of Microelectronics Two-Phase Liquid Cooling With Backside-Embedded Micro-Pin Fins for High-Power Microelectronics Huicheng Feng, Gongyue Tang, Xiaowu Zhang, Boon Long Lau, Ming Chinq Jong 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
24 Feb 2026 SERC Institute of Microelectronics Magnetohydrodynamic-Driven Liquid Metal Cooling for High-Power Electronics Huicheng Feng, Gongyue Tang, Wei Kin Tan 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
12 Nov 2025 SERC Institute of Microelectronics Two-phase Liquid Cooling of Vertically Stacked High-Power Chips with Backside-Embedded Micro-Pin Fins Huicheng Feng, Gongyue Tang, Xiaowu Zhang, Boon Long Lau, Ming Chinq Jong IEEE Transactions on Components, Packaging and Manufacturing Technology
4 Sep 2025 SERC Institute of Microelectronics Investigation of coolant-dependent thermal performance in backside-embedded micro-pin fin arrays for high-power microelectronics cooling Huicheng Feng, Gongyue Tang, Xiaowu Zhang International Journal of Thermal Sciences
26 Jun 2025 SERC Institute of Microelectronics Development of an Embedded 2-Phase Cooling Solution for Two Stacked High-Power Chips in Future HPC HPC and AI Applications Xiaowu Zhang, Huicheng Feng, Gongyue Tang, Boon Long Lau, Ming Chinq Jong, Surya Bhattacharya, Vempati Srinivasa Rao 2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
26 Jun 2025 SERC Institute of Microelectronics Thermal Characterization of HBMs Integrated via Hybrid Bonding Huicheng Feng, Yong Han, Gongyue Tang, Ling Xie, Vasarla Nagendra Sekhar 2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
11 Mar 2025 SERC Institute of Microelectronics Assembly of Multi-Device Power Package with Clips as Interconnects Leong Ching Wai, Yi Xuan Yeo, Jacob Jordan Soh, Gongyue Tang 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)