|
17 Jun 2026
|
SERC
|
Institute of Microelectronics
|
Liquid Metal Cooling for High-Power Electronics Driven by Magnetohydrodynamic Effect (Pending publish)
|
Huicheng Feng,
Bin He,
Gongyue Tang,
Xiaowu Zhang,
Wei Kin Tan
|
2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
|
|
17 Jun 2026
|
SERC
|
Institute of Microelectronics
|
Process Development of Two-Stacked Chips with a Backside Embedded Two-Phase Cooling Solution (Pending publish)
|
Xiaowu Zhang,
Boon Long Lau,
Huicheng Feng,
Gongyue Tang,
Ming Chinq Jong,
Surya Bhattacharya,
Vempati Srinivasa Rao,
B.S.S. Chandra Rao,
Tran Van Nhat Anh
|
2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
|
|
6 Mar 2026
|
SERC
|
Institute of Microelectronics
|
Enhancing Thermal Uniformity in Liquid-Cooled Inverters: Adjoint-Based Optimization of a Manifold Microchannel Coldplate
|
Bin He,
Gongyue Tang
|
IEEE Transactions on Components, Packaging and Manufacturing Technology
|
|
24 Feb 2026
|
SERC
|
Institute of Microelectronics
|
Two-Phase Liquid Cooling With Backside-Embedded Micro-Pin Fins for High-Power Microelectronics (Pending publish)
|
Huicheng Feng,
Gongyue Tang,
Xiaowu Zhang,
Boon Long Lau,
Ming Chinq Jong
|
2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
|
|
24 Feb 2026
|
SERC
|
Institute of Microelectronics
|
Magnetohydrodynamic-Driven Liquid Metal Cooling for High-Power Electronics (Pending publish)
|
Huicheng Feng,
Gongyue Tang,
Wei Kin Tan
|
2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
|
|
12 Nov 2025
|
SERC
|
Institute of Microelectronics
|
Two-phase Liquid Cooling of Vertically Stacked High-Power Chips with Backside-Embedded Micro-Pin Fins
|
Huicheng Feng,
Gongyue Tang,
Xiaowu Zhang,
Boon Long Lau,
Ming Chinq Jong
|
IEEE Transactions on Components, Packaging and Manufacturing Technology
|
|
4 Sep 2025
|
SERC
|
Institute of Microelectronics
|
Investigation of coolant-dependent thermal performance in backside-embedded micro-pin fin arrays for high-power microelectronics cooling
|
Huicheng Feng,
Gongyue Tang,
Xiaowu Zhang
|
International Journal of Thermal Sciences
|
|
26 Jun 2025
|
SERC
|
Institute of Microelectronics
|
Development of an Embedded 2-Phase Cooling Solution for Two Stacked High-Power Chips in Future HPC HPC and AI Applications (Pending publish)
|
Xiaowu Zhang,
Huicheng Feng,
Gongyue Tang,
Boon Long Lau,
Ming Chinq Jong,
Surya Bhattacharya,
Vempati Srinivasa Rao
|
2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
|
|
26 Jun 2025
|
SERC
|
Institute of Microelectronics
|
Thermal Characterization of HBMs Integrated via Hybrid Bonding
|
Huicheng Feng,
Yong Han,
Gongyue Tang,
Ling Xie,
Vasarla Nagendra Sekhar
|
2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
|
|
11 Mar 2025
|
SERC
|
Institute of Microelectronics
|
Assembly of Multi-Device Power Package with Clips as Interconnects
|
Leong Ching Wai,
Yi Xuan Yeo,
Jacob Jordan Soh,
Gongyue Tang
|
2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)
|