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Publication date Communities Collections Article title Author(s) Journal/Conference
18 Jan 2023 SERC Institute for Infocomm Research Improved Bump Detection and Defect Identification for HBMs using Refined Machine Learning Approach Wang Jie, Richard Chang, Xu Xun, Cai Lile, Chuang Sheng Foo, Ramanpreet Singh Pahwa 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
21 Nov 2022 SERC Institute for Infocomm Research DA-CIL: Towards Domain Adaptive Class-Incremental 3D Object Detection Ziyuan Zhao, Mingxi Xu, Peisheng Qian, Ramanpreet Singh Pahwa, Richard Chang 33rd British Machine Vision Conference 2022
18 Oct 2022 SERC Institute for Infocomm Research Exploring Active Learning for Semiconductor Defect Segmentation Lile Cai, Ramanpreet Singh Pahwa, Xun Xu, Jie Wang, Richard Chang, Lining Zhang, Chuan-Sheng Foo 2022 IEEE International Conference on Image Processing (ICIP)
12 Jul 2022 SERC Institute for Infocomm Research Automated Detection and Segmentation of HBMs in 3D X-ray Images using Semi-Supervised Deep Learning Ramanpreet Singh Pahwa, Richard Chang, Wang Jie, Xu Xun, Oo Zaw Min, Foo Chuan Sheng, Chong Ser Choong, Vempati Srinivasa Rao 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
27 Apr 2022 SERC Institute for Infocomm Research On the Use of Component Structural Characteristics for Voxel Segmentation in Semicon 3D Images Tin Lay Nwe, Ramanpreet Singh Pahwa, Richard Chang, Oo Zaw Min, Wang Jie, Yiqun Li, Dongyun Lin, Shitala Prasad, Sheng Dong ICASSP 2022 - 2022 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP)
13 Apr 2022 SERC Institute for Infocomm Research Creating Semi-supervised learning-based Adaptable Object Detection Models for Autonomous Service Robot Richard Chang, Ramanpreet Singh Pahwa, Jie Wang, Lawrence Chen, Sankeerthana Satini, Kong Wah Wan, David Hsu SSRN Electronic Journal
2 Nov 2021 SERC Institute for Infocomm Research A Survey on Object Detection Performance with Different Data Distributions Ramanpreet Singh Pahwa, Richard Chang, Wang Jie, Sankeerthana Satini, Chandrashekar Viswanathan, Du Yiming, Vernica Jain, Chen Tai Pang, Wan Kong Wah Lecture Notes in Computer Science
10 Aug 2021 SERC Institute for Infocomm Research, Institute of Microelectronics Automated Attribute Measurements of Buried Package Features in 3D X-ray Images using Deep Learning Ramanpreet Singh Pahwa, Ma Tin Lay Nwe, Richard Chang, Oo Zaw Min, Wang Jie, Saisubramaniam Gopalakrishnan, David Ho Soon Wee, Ren Qin, Vempati Srinivasa Rao, Haiwen Dai, Jens Timo Neumann, Ramani Pichumani, Tom Gregorich 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021 SERC Institute for Infocomm Research, Institute of Microelectronics Automated Void Detection in TSVs from 2D X-Ray Scans using Supervised Learning with 3D X-Ray Scans Ramanpreet Singh Pahwa, Saisubramaniam Gopalakrishnan, Huang Su, Ong Ee Ping, Haiwen Dai, David Ho Soon Wee, Ren Qin, Vempati Srinivasa Rao 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
1 Dec 2020 SERC Institute for Infocomm Research MACHINE-LEARNING BASED METHODOLOGIES FOR 3D X-RAY MEASUREMENT, CHARACTERIZATION AND OPTIMIZATION FOR BURIED STRUCTURES IN ADVANCED IC PACKAGES Ramanpreet Singh Pahwa, Tin Lay Nwe, Richard Chang, Zaw Min, Wang Jie, Tom Gregorich, David Ho, Vempati Srinivasa Rao International Wafer Level Packaging Conference (IWLPC)