Wafer-Scale Encapsulated Saw Temperature and Pressure Sensors for Harsh Environments

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Wafer-Scale Encapsulated Saw Temperature and Pressure Sensors for Harsh Environments
Title:
Wafer-Scale Encapsulated Saw Temperature and Pressure Sensors for Harsh Environments
Journal Title:
2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS)
Keywords:
Publication Date:
15 March 2021
Citation:
Ng, E. J., Sharma, J., Ching, E. W. L., Wu, G., Pohl, D., & Vancauwenberghe, O. (2021). Wafer-Scale Encapsulated Saw Temperature and Pressure Sensors for Harsh Environments. 2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS). https://doi.org/10.1109/mems51782.2021.9375369
Abstract:
Passive SAW sensors do not require circuitry or power and are ideal for harsh environments or rotating machinery. AlN-based thin film SAW resonators for temperature and pressure sensors have been developed in this work using AlGe wafer-scale encapsulation for device protection, pressure reference, high stability, and small size. Temperature and pressure co-testing of both sensors up to 160°C and 60 bar revealed ~1% full-scale accuracy.
License type:
Publisher Copyright
Funding Info:
This research is funded by Industry.
Description:
© 2021 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
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