Wafer-Scale Encapsulated Saw Temperature and Pressure Sensors for Harsh Environments

Wafer-Scale Encapsulated Saw Temperature and Pressure Sensors for Harsh Environments

2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS)

10.1109/MEMS51782.2021.9375369

http://dx.doi.org/10.1109/mems51782.2021.9375369

Eldwin J. Ng, Jaibir Sharma, Eva Wai Leong Ching, Guoqiang Wu, Didier Pohl, Olivier Vancauwenberghe

15 March 2021

Ng, E. J., Sharma, J., Ching, E. W. L., Wu, G., Pohl, D., & Vancauwenberghe, O. (2021). Wafer-Scale Encapsulated Saw Temperature and Pressure Sensors for Harsh Environments. 2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS). https://doi.org/10.1109/mems51782.2021.9375369

Passive SAW sensors do not require circuitry or power and are ideal for harsh environments or rotating machinery. AlN-based thin film SAW resonators for temperature and pressure sensors have been developed in this work using AlGe wafer-scale encapsulation for device protection, pressure reference, high stability, and small size. Temperature and pressure co-testing of both sensors up to 160°C and 60 bar revealed ~1% full-scale accuracy.

Publisher Copyright

This research is funded by Industry.

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https://oar.a-star.edu.sg/communities-collections/articles/18467

Institute of Microelectronics