Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
---|---|---|---|---|---|
30 May 2017 | SERC | Institute of Microelectronics | Extremely High Temperature and High Pressure (x-HTHP) Endurable SOI Device and Sensor Packaging for Harsh Environment Applications | F.X. Che, Eva Wai Leong Ching, K.Y. Au | 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) |