Collapse

Search results

Publication date Communities Collections Article title Author(s) Journal/Conference
13 Nov 2021 SERC Institute of Microelectronics Silicon-On-Nothing ScAlN pMUTs David Sze Wai Choong, Daniel Ssu-Han Chen, Duan Jian Goh, Jihang Liu, Sagnik Ghosh, Yul Koh, Jaibir Sharma, Srinivas Merugu, Fabio Quaglia, Marco Ferrera, Alessandro Stuart Savoia, Eldwin Jiaqiang Ng 2021 IEEE International Ultrasonics Symposium (IUS)
12 Nov 2021 SERC Institute of Microelectronics High Resolution, High Frequency Ultrasonic Ranging in Air with pMUTs Yul Koh, David Sze Wai Choong, Daniel Ssu-Han Chen, Duan Jian Goh, Sagnik Ghosh, Jaibir Sharma, Srinivas Merugu, Fabio Quaglia, Marco Ferrera, Alessandro Stuart Savoia, Eldwin Jiaqiang Ng 2021 IEEE International Ultrasonics Symposium (IUS)
12 Nov 2021 SERC Institute of Microelectronics Reduced TCF, High Frequency, Piezoelectric Contour-Mode Resonators with Silicon-on-Nothing Sagnik Ghosh, Jaibir Sharma, Eldwin J. Ng, Duan Jian Goh, Srinivas Merugu, Yul Koh, Amit Lal 2021 IEEE International Ultrasonics Symposium (IUS)
12 Nov 2021 SERC Institute of Microelectronics Investigation of Localized Flexural Lamb Wave for Acoustofluidic Actuation and Particle Control Philippe Vachon, Srinivas Merugu, Jaibir Sharma, Amit Lal, Eldwin J. Ng, Chengkuo Lee 2021 IEEE International Ultrasonics Symposium (IUS)
12 Nov 2021 SERC Institute of Microelectronics Piezoelectric over Silicon-on-Nothing (pSON) process Jaibir Sharma, Duan Jian Goh, Srinivas Merugu, Yul Koh, Sagnik Ghosh, Md Hazwani Khairy, Eldwin Jiaqiang Ng 2021 IEEE International Ultrasonics Symposium (IUS)
15 Mar 2021 SERC Institute of Microelectronics Wafer-Scale Encapsulated Saw Temperature and Pressure Sensors for Harsh Environments Eldwin J. Ng, Jaibir Sharma, Eva Wai Leong Ching, Guoqiang Wu, Didier Pohl, Olivier Vancauwenberghe 2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS)
9 Jun 2015 SERC Institute of Microelectronics A Robust Bilayer Cap in Thin Film Encapsulation for MEMS Device Application Jaibir Sharma, Jae-Wung Lee, Srinivas Merugu, Navab Singh IEEE Transactions on Components, Packaging and Manufacturing Technology
15 May 2015 SERC Institute of Microelectronics Cavity-enhanced sacrificial layer micromachining for faster release of thin film encapsulated MEMS Jae-Wung Lee, Jaibir Sharma, Margarita Sofia Narducci, Srinivas Merugu, Xiao Lin Zhang, Singh Navab Journal of Micromechanics and Microengineering
1 Aug 2014 SERC Institute of Microelectronics Robust Pop-Up Shape Encapsulation Using Dual-Sealing Jae-Wung Lee, Jaibir Sharma, Srinivas Merugu, Navab Singh Journal of Microelectromechanical Systems
28 Feb 2014 SERC Institute of Microelectronics Integration of AlN with molybdenum electrodes and sacrificial amorphous silicon release using XeF2 Jaibir Sharma, Sanchitha Fernando, Wee Ming Tan Journal of Micromechanics and Microengineering