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13 Nov 2021
SERC
Institute of Microelectronics
Silicon-On-Nothing ScAlN pMUTs
David Sze Wai Choong,
Daniel Ssu-Han Chen,
Duan Jian Goh,
Jihang Liu,
Sagnik Ghosh,
Yul Koh,
Jaibir Sharma,
Srinivas Merugu,
Fabio Quaglia,
Marco Ferrera,
Alessandro Stuart Savoia,
Eldwin Jiaqiang Ng
2021 IEEE International Ultrasonics Symposium (IUS)
12 Nov 2021
SERC
Institute of Microelectronics
Piezoelectric over Silicon-on-Nothing (pSON) process
Jaibir Sharma,
Duan Jian Goh,
Srinivas Merugu,
Yul Koh,
Sagnik Ghosh,
Md Hazwani Khairy,
Eldwin Jiaqiang Ng
2021 IEEE International Ultrasonics Symposium (IUS)
12 Nov 2021
SERC
Institute of Microelectronics
Investigation of Localized Flexural Lamb Wave for Acoustofluidic Actuation and Particle Control
Philippe Vachon,
Srinivas Merugu,
Jaibir Sharma,
Amit Lal,
Eldwin J. Ng,
Chengkuo Lee
2021 IEEE International Ultrasonics Symposium (IUS)
12 Nov 2021
SERC
Institute of Microelectronics
Reduced TCF, High Frequency, Piezoelectric Contour-Mode Resonators with Silicon-on-Nothing
Sagnik Ghosh,
Jaibir Sharma,
Eldwin J. Ng,
Duan Jian Goh,
Srinivas Merugu,
Yul Koh,
Amit Lal
2021 IEEE International Ultrasonics Symposium (IUS)
12 Nov 2021
SERC
Institute of Microelectronics
High Resolution, High Frequency Ultrasonic Ranging in Air with pMUTs
Yul Koh,
David Sze Wai Choong,
Daniel Ssu-Han Chen,
Duan Jian Goh,
Sagnik Ghosh,
Jaibir Sharma,
Srinivas Merugu,
Fabio Quaglia,
Marco Ferrera,
Alessandro Stuart Savoia,
Eldwin Jiaqiang Ng
2021 IEEE International Ultrasonics Symposium (IUS)
15 Mar 2021
SERC
Institute of Microelectronics
Wafer-Scale Encapsulated Saw Temperature and Pressure Sensors for Harsh Environments
Eldwin J. Ng,
Jaibir Sharma,
Eva Wai Leong Ching,
Guoqiang Wu,
Didier Pohl,
Olivier Vancauwenberghe
2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS)
9 Jun 2015
SERC
Institute of Microelectronics
A Robust Bilayer Cap in Thin Film Encapsulation for MEMS Device Application
Jaibir Sharma,
Jae-Wung Lee,
Srinivas Merugu,
Navab Singh
IEEE Transactions on Components, Packaging and Manufacturing Technology
15 May 2015
SERC
Institute of Microelectronics
Cavity-enhanced sacrificial layer micromachining for faster release of thin film encapsulated MEMS
Jae-Wung Lee,
Jaibir Sharma,
Margarita Sofia Narducci,
Srinivas Merugu,
Xiao Lin Zhang,
Singh Navab
Journal of Micromechanics and Microengineering
1 Aug 2014
SERC
Institute of Microelectronics
Robust Pop-Up Shape Encapsulation Using Dual-Sealing
Jae-Wung Lee,
Jaibir Sharma,
Srinivas Merugu,
Navab Singh
Journal of Microelectromechanical Systems
28 Feb 2014
SERC
Institute of Microelectronics
Integration of AlN with molybdenum electrodes and sacrificial amorphous silicon release using XeF2
Jaibir Sharma,
Sanchitha Fernando,
Wee Ming Tan
Journal of Micromechanics and Microengineering
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