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18 Mar 2024 SERC Institute of Microelectronics Room Temperature Plasma-Enhanced Niobium-Niobium Wafer Bonding for 3D Integration of Superconducting Interconnects for Quantum Processing (Pending publish) Simon Chun Kiat Goh, Cheemalamarri Hemanth Kumar, Liangxing Hu, Woon Shervonne, Norhanani Jaafar, Yap Lee Khoon Sherry, Ding Huang, Chit Siong Lau, Senthil Kumar Karuppannan, Hongyu Li, Chuan Seng Tan, King-Jien Chui 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024 SERC Institute of Microelectronics Process Development and Integration on Si Substrate for Ion trap-based Quantum Processors (Pending publish) H. Y. Li, Clarence Liu Huihong, Norhanani Jaafar, Morteza Ahmadi, Mishra Dileep Kumar, Goh Chun Kiat Simonl, Zhou YanYan, Manas Mukherjee, Chui King Jien 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024 SERC Institute of Microelectronics Through Mold Vertical Interconnect Formation in FOWLP using conductive paste (Pending publish) Serine Soh Siew Boon, Soon Wee David Ho, Norhanani Jaafar 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
12 Mar 2024 SERC Institute of Microelectronics SF6 mixed in N2 gas sensing responses from CMOS-compatible AlN and ScAlN pyroelectric detectors Doris K. T. Ng, Weiguo Chen, Linfang Xu, Harmony J. E. Lau, Landobasa Tobing, Chong Pei Ho, Wing Wai Chung, Norhanani Jaafar, Hanfeng Fu, Qingxin Zhang MOEMS and Miniaturized Systems XXIII
13 Mar 2023 SERC Institute of Microelectronics On-chip CO2 sensor integrated with MEMS emitter and pyroelectric detector Hong Cai, Md Hazwani Khairy, Rachel Ang, Linfang Xu, Doris Ng, Nanxi Li, Zhonghua Gu, Anmin Kong, Weiguo Chen, Wen Wei Seit, Eva Wai Leong Ching, Norhanani Jaafar, Huanhuan Wang, Landobasa Y.M. Tobing, Leh Woon Lim, Qingxin Zhang, Lennon Yao Ting Lee Silicon Photonics XVIII
5 Jan 2022 SERC Institute of Microelectronics Fabrication Process Flow of Antenna-in-Package Fan-out Wafer Level Packaging Lau Boon Long, David Ho, Lim Teck Guan, Hsiao Hsiang Yao, Lim Pei Siang, Norhanani Jaafar 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
4 Oct 2021 SERC Institute of Microelectronics 3D Cryogenic Interposer for Quantum Computing Application Hongyu Li, Chit Siong Aaron Lau, Norhanani Jaafar, Rainer Cheow Siong Lee, Calvin Pei Yu Wong, Kuan Eng Johnson Goh, King-Jien Chui 2022 IEEE 72nd Electronic Components and Technology Conference
16 Jul 2021 SERC Institute of Microelectronics NDIR CO2 gas sensing using CMOS compatible MEMS ScAlN-based pyroelectric detector Doris Keh Ting Ng, Chong Pei Ho, Linfang Xu, Weiguo Chen, Yuan Hsing Fu, Tantan Zhang, Li Yan Siow, Norhanani Jaafar, Eldwin Jiaqiang Ng, Yuan Gao, Hong Cai, Qingxin Zhang, Lennon Yao Ting Lee Sensors and Actuators B: Chemical