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13 Mar 2023
SERC
Institute of Microelectronics
On-chip CO2 sensor integrated with MEMS emitter and pyroelectric detector
Hong Cai,
Md Hazwani Khairy,
Rachel Ang,
Linfang Xu,
Doris Ng,
Nanxi Li,
Zhonghua Gu,
Anmin Kong,
Weiguo Chen,
Wen Wei Seit,
Eva Wai Leong Ching,
Norhanani Jaafar,
Huanhuan Wang,
Landobasa Y.M. Tobing,
Leh Woon Lim,
Qingxin Zhang,
Lennon Yao Ting Lee
Silicon Photonics XVIII
5 Jan 2022
SERC
Institute of Microelectronics
Heating Dissipation Discussion of TSV-integrated Ion Trap with Glass Interposer
Peng Zhao,
Xin Wen Bi,
Hong Yu Li,
Yu Dian Lim,
Wen Wei Seit,
Luca Guidoni,
Chuan Seng Tan
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022
SERC
Institute of Microelectronics
Comprehensive Study on Polymer Based Chip-to/chip Bonding for Gas Sensor Application
Wen Wei Seit,
Ser Choong Chong,
Cai Hong,
Eva Wai,
Rachel Ang
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022
SERC
Institute of Microelectronics
Addressing the assembly challenges of Antenna-in-package
Sharon Pei Siang Lim,
Ser Choong Chong,
David Ho Soon Wee,
Wen Wei Seit,
Jacob Jordan Soh,
Tai Chong Chai
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
20 Sep 2021
SERC
Institute of Microelectronics
RF Performance Benchmarking of TSV Integrated Surface Electrode Ion Trap for Quantum Computing
Peng Zhao,
Hong Yu Li,
Jing Tao,
Jean-Pierre Likforman,
Yu Dian Lim,
Wen Wei Seit,
Luca Guidoni,
Chuan Seng Tan
IEEE Transactions on Components, Packaging and Manufacturing Technology
10 Aug 2021
SERC
Institute of Microelectronics
Low Cost Grounding Integration for Surface Ion Trap
Hongyu Li,
Wen Wei Seit,
Hwang Gilho,
Peng Zhao,
Jing. Tao,
Chuan Seng Tan
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021
SERC
Institute of Microelectronics
Comprehensive Study of Thermal Impact on Warpage Behaviour of FOWLP with Different Die to Mold Ratio
Ser Choong Chong,
Simon Siak Boon Lim,
Wen Wei Seit,
Tai Chong Chai,
Debbie Claire Sanchez
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
1 May 2021
SERC
Institute of Microelectronics
Large‐Scale Fabrication of Surface Ion Traps on a 300 mm Glass Wafer
Jing Tao,
Jean-Pierre Likforman,
Peng Zhao,
Hong Yu Li,
Theo Henner,
Yu Dian Lim,
Wen Wei Seit,
Luca Guidoni,
Chuan Seng Tan
physica status solidi (b)
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