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Publication date Communities Collections Article title Author(s) Journal/Conference
13 Mar 2023 SERC Institute of Microelectronics On-chip CO2 sensor integrated with MEMS emitter and pyroelectric detector Hong Cai, Md Hazwani Khairy, Rachel Ang, Linfang Xu, Doris Ng, Nanxi Li, Zhonghua Gu, Anmin Kong, Weiguo Chen, Wen Wei Seit, Eva Wai Leong Ching, Norhanani Jaafar, Huanhuan Wang, Landobasa Y.M. Tobing, Leh Woon Lim, Qingxin Zhang, Lennon Yao Ting Lee Silicon Photonics XVIII
5 Jan 2022 SERC Institute of Microelectronics Heating Dissipation Discussion of TSV-integrated Ion Trap with Glass Interposer Peng Zhao, Xin Wen Bi, Hong Yu Li, Yu Dian Lim, Wen Wei Seit, Luca Guidoni, Chuan Seng Tan 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Comprehensive Study on Polymer Based Chip-to/chip Bonding for Gas Sensor Application Wen Wei Seit, Ser Choong Chong, Cai Hong, Eva Wai, Rachel Ang 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Addressing the assembly challenges of Antenna-in-package Sharon Pei Siang Lim, Ser Choong Chong, David Ho Soon Wee, Wen Wei Seit, Jacob Jordan Soh, Tai Chong Chai 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
20 Sep 2021 SERC Institute of Microelectronics RF Performance Benchmarking of TSV Integrated Surface Electrode Ion Trap for Quantum Computing Peng Zhao, Hong Yu Li, Jing Tao, Jean-Pierre Likforman, Yu Dian Lim, Wen Wei Seit, Luca Guidoni, Chuan Seng Tan IEEE Transactions on Components, Packaging and Manufacturing Technology
10 Aug 2021 SERC Institute of Microelectronics Low Cost Grounding Integration for Surface Ion Trap Hongyu Li, Wen Wei Seit, Hwang Gilho, Peng Zhao, Jing. Tao, Chuan Seng Tan 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021 SERC Institute of Microelectronics Comprehensive Study of Thermal Impact on Warpage Behaviour of FOWLP with Different Die to Mold Ratio Ser Choong Chong, Simon Siak Boon Lim, Wen Wei Seit, Tai Chong Chai, Debbie Claire Sanchez 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
1 May 2021 SERC Institute of Microelectronics Large‐Scale Fabrication of Surface Ion Traps on a 300 mm Glass Wafer Jing Tao, Jean-Pierre Likforman, Peng Zhao, Hong Yu Li, Theo Henner, Yu Dian Lim, Wen Wei Seit, Luca Guidoni, Chuan Seng Tan physica status solidi (b)