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Publication date Communities Collections Article title Author(s) Journal/Conference
18 Mar 2024 SERC Institute of Microelectronics Characterization of Differential TMV Vertical Interconnects to 50GHz with Double Side Measurement Wu Jiaqi, Lim Teck Guan, Jason Tsung-Yang Liow, Sajay Bhuvanendran Nair Gourikutty 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024 SERC Institute of Microelectronics Parasitic Surface Conduction Effect of TSV on Interconnection Performance in RF SOI for 2.5D Integration Zhou Lin, Lim Teck Guan, Wu Jiaqi, Xu Feng, Jong Ming Chinq, Ng Yong Chyn 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024 SERC Institute of Microelectronics Characterization of FOWLP Antenna in Packages Sun Mei, Lim Teck Guan, Zhou Lin 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics RF Performance Study of Through-Mold-Via (TMV) using L-2L De-Embedding Method Wu Jiaqi, Li Kangrong, Lim Teck Guan 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics A 2.5D Heterogeneous Integration Demonstration for High Performance RF Application using High-Resistivity Through Si Interposer (TSI) Woon Leng Loh, Lim Teck Guan, K.-J. Chui 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Dual Polarized FOWLP AiP for 5G Base Station Applications Sun Mei, Lim Teck Guan 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Fabrication Process Flow of Antenna-in-Package Fan-out Wafer Level Packaging Lau Boon Long, David Ho, Lim Teck Guan, Hsiao Hsiang Yao, Lim Pei Siang, Norhanani Jaafar 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
10 Aug 2021 SERC Institute of Microelectronics FOWLP and Si-Interposer for High-Speed Photonic Packaging Lim Teck Guan, Eva Wai Leong Ching, Jong Ming Ching, Loh Woon Leng, David Ho Soon Wee, Surya Bhattacharya 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021 SERC Institute of Microelectronics Heterogeneous Integration with Embedded Fine Interconnect Chai Tai Chong, Lim Teck Guan, David Ho, Han Yong, Chong Ser Choong, Sharon Lim Pei Siang, Surya Bhattacharya 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)