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Publication date Communities Collections Article title Author(s) Journal/Conference
3 Aug 2023 SERC Institute of Microelectronics High-Performance Amplifier Package Design for Heterogenous Integration on Si-interposer Teck Guan Lim, Lin Zho, Sasi Kumar Tippabhotla, Ji Lin, Jong Ming Chinq, Jiaqi Wu, Tang Gongyue, Eva Wai Leong Ching, Yong Chyn Ng, King Jien Chui, Wei Jia Lu, Chee Heng Goh, Sek Lin Pek, Jun Wei Agnes Loh 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics On the effect of partial underfilling on the fatigue life of flip-chip micro-solder bumps in a heterogeneously integrated TSI package using finite element simulations Sasi Kumar Tippabhotla, Lin Ji 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
5 Jan 2022 SERC Institute of Microelectronics A comparative study of stress-based and fracture mechanics-based finite element simulation approaches for RDL based wafer level package Sasi Kumar Tippabhotla, Lin Ji, Tai Chong Chai 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Numerical study on wafer level warpage evolution during chip to wafer hybrid bonding process Lin Ji, Masaya Kawano, Sasi Kumar Tippabhotla, Woon Leng Loh 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)