| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 18 Mar 2024 | SERC | Institute of Microelectronics | Identify critical packaging parameters impacting wafer warpage using FEA and statistical analysis techniques | Ji Lin, Ng Yong Chyn | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |
| 3 Aug 2023 | SERC | Institute of Microelectronics | High-Performance Amplifier Package Design for Heterogenous Integration on Si-interposer | Teck Guan Lim, Lin Zho, Sasi Kumar Tippabhotla, Ji Lin, Jong Ming Chinq, Jiaqi Wu, Tang Gongyue, Eva Wai Leong Ching, Yong Chyn Ng, King Jien Chui, Wei Jia Lu, Chee Heng Goh, Sek Lin Pek, Jun Wei Agnes Loh | 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) |