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Publication date Communities Collections Article title Author(s) Journal/Conference
15 Mar 2021 Others Institute of Microelectronics Wafer-Scale Encapsulated Saw Temperature and Pressure Sensors for Harsh Environments Eldwin J. Ng, Jaibir Sharma, Eva Wai Leong Ching, Guoqiang Wu, Didier Pohl, Olivier Vancauwenberghe 2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS)