Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
---|---|---|---|---|---|
15 Mar 2021 | SERC | Institute of Microelectronics | Wafer-Scale Encapsulated Saw Temperature and Pressure Sensors for Harsh Environments | Eldwin J. Ng, Jaibir Sharma, Eva Wai Leong Ching, Guoqiang Wu, Didier Pohl, Olivier Vancauwenberghe | 2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS) |