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Publication date Communities Collections Article title Author(s) Journal/Conference
17 Jun 2026 SERC Institute of Microelectronics High-Density, Energy-Efficient CPO Platform with PIC-in-Mold Interposer Architecture for AI/ML Data Centers (Pending publish) Sajay Bhuvanendran Nair Gourikutty, Wu Jiaqi, Zhonghua Yang, Mihai Rotaru, Ji Lin, Han Yong, Chia Lai Yee, Sharon Lim, San Sandra, Chai Tai Chong, Surya Bhattacharya 2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
17 Jun 2026 SERC Institute of Microelectronics Vertical Interconnects Characterization for 448 Gbps/lane Co-Packaged Optics using Double-Sided Probing Method Jiaqi Wu, Sajay Bhuvanendran Nair Gourikutty, Teck Guan Lim, Surya Bhattacharya 2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
17 Jun 2026 SERC Institute of Microelectronics Process Development of Two-Stacked Chips with a Backside Embedded Two-Phase Cooling Solution Xiaowu Zhang, Boon Long Lau, Huicheng Feng, Gongyue Tang, Ming Chinq Jong, Surya Bhattacharya, Vempati Srinivasa Rao, B.S.S. Chandra Rao, Tran Van Nhat Anh 2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
24 Feb 2026 SERC Institute of Microelectronics Numerical Investigation of Embedded Micro Pin-Fin Two-Phase Liquid Cooling for Dual-Chip Stacks in HPC and AI Systems Chinmaya Kumar Patra, Anandaroop Bhattacharya, Prasanta Kumar Das, Xiaowu Zhang, Surya Bhattacharya, Vempati Srinivasa Rao 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
26 Jun 2025 SERC Institute of Microelectronics Development of an Embedded 2-Phase Cooling Solution for Two Stacked High-Power Chips in Future HPC HPC and AI Applications Xiaowu Zhang, Huicheng Feng, Gongyue Tang, Boon Long Lau, Ming Chinq Jong, Surya Bhattacharya, Vempati Srinivasa Rao 2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
7 Nov 2024 SERC Institute of Microelectronics 1.6 Tbps FOWLP-Based Silicon Photonic Engine for Co-Packaged Optics Xin Li, Sajay Bhuvanendran Nair Gourikutty, Jiaqi Wu, Teck Guan Lim, Pengfei Guo, Jaye Charles Davies, Edward Sing Chee Koh, Boon Long Lau, Ming Chinq Jong, Ser Choong Chong, San Sandra, Chao Li, Guo-Qiang Lo, Surya Bhattacharya, Jason Tsung-Yang Liow Journal of Lightwave Technology
26 Jun 2024 SERC Institute of Microelectronics A Compact Wafer-Level Heterogeneously Integrated Scalable Optical Transceiver for Data Centers Sajay Bhuvanendran Nair Gourikutty, Jiaqi Wu, Teck Guan Lim, San Sandra, Ming Chinq Jong, Chia Lai Yee, Lau Boon Long, David Soon Wee Ho, Chong Ser Choong, Ding Liang, Xiaoguang Tu, Wanjun Wang, Chee-Keong Tan, Alison See, Hsiu-Che Wang, Roberto Coccioli, Ronson Tan, Radhakrishnan Nagarajan, Surya Bhattacharya 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres Sajay Bhuvanendran Nair Gourikutty, Lau Boon Long, Seit Wen Wei, Ming Chinq Jong, David Soon Wee Ho, Jiaqi Wu, Teck Guan Lim, Rathin Mandal, Chong Ser Choong, Chia Lai Yee, Xin Li, Jason Tsung-Yang Liow, Surya Bhattacharya 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
24 Jul 2023 SERC Institute of Microelectronics Multi-Chiplet Heterogeneous Integration Packaging for Semiconductor System Scaling Surya Bhattacharya, Vempati Srinivasa Rao 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
5 Jan 2022 SERC Institute of Microelectronics Towards Heterogeneous Integrated Electronic-Photonic Packages for Hyperscale Data Centers Sajay Bhuvanendran Nair Gourikutty, Ming Chinq Jong, Chockanathan Vinoth Kanna, David Soon Wee Ho, Jiaqi Wu, Rathin Mandal, Nanxi Li, Teck Guan Lim, Jason Tsung-Yang Liow, Surya Bhattacharya 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)