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26 Jun 2024 SERC Institute of Microelectronics A Compact Wafer-Level Heterogeneously Integrated Scalable Optical Transceiver for Data Centers (Pending publish) Sajay Bhuvanendran Nair Gourikutty, Jiaqi Wu, Teck Guan Lim, San Sandra, Ming Chinq Jong, Chia Lai Yee, Lau Boon Long, David Soon Wee Ho, Chong Ser Choong, Ding Liang, Xiaoguang Tu, Wanjun Wang, Chee-Keong Tan, Alison See, Hsiu-Che Wang, Roberto Coccioli, Ronson Tan, Radhakrishnan Nagarajan, Surya Bhattacharya 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
1 Apr 2024 SERC Institute of Microelectronics 77-GHz FOWLP MIMO AiP for Compact High-Resolution Radar With Horizontally and Vertically Long- and Medium-Range Sensing Mei Sun, Teck Guan Lim, David Soon Wee Ho, Jiaqi Wu, Tai Chong Chai, Yugang Ma IEEE Transactions on Components, Packaging and Manufacturing Technology
3 Aug 2023 SERC Institute of Microelectronics A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres Sajay Bhuvanendran Nair Gourikutty, Lau Boon Long, Seit Wen Wei, Ming Chinq Jong, David Soon Wee Ho, Jiaqi Wu, Teck Guan Lim, Rathin Mandal, Chong Ser Choong, Chia Lai Yee, Xin Li, Jason Tsung-Yang Liow, Surya Bhattacharya 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
5 Jan 2022 SERC Institute of Microelectronics Towards Heterogeneous Integrated Electronic-Photonic Packages for Hyperscale Data Centers Sajay Bhuvanendran Nair Gourikutty, Ming Chinq Jong, Chockanathan Vinoth Kanna, David Soon Wee Ho, Jiaqi Wu, Rathin Mandal, Nanxi Li, Teck Guan Lim, Jason Tsung-Yang Liow, Surya Bhattacharya 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Through Mold Via Development Using Laser Drilling Process for 3D Fan-out Wafer Level Package Hsiang-Yao Hsiao, David Soon Wee Ho, Ser Choong Chong, Tai Chong Chai, David Schutzberger, Yariv Oz, Guy Amrani 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
30 May 2017 SERC Institute of Microelectronics Drop Impact Reliability Test and Failure Analysis for Large Size High Density FOWLP Package on Package Zhaohui Chen, Faxing Che, Mian Zhi Ding, David Soon Wee Ho, Tai Chong Chai, Vempati Srinivasa 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
30 May 2017 SERC Institute of Microelectronics Forming a vertical interconnect structure using dry film processing for Fan Out Wafer Level Packaging Yew Wing Leong, Hsiang-Yao Hsiao, David Soon Wee Ho, Boon Long Lau, Huamao Lin 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
1 Aug 2015 SERC Institute of Microelectronics Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC–TSI) Guruprasad Katti, David Soon Wee Ho, Hong Yu Li, Rahul Dutta, Roshan Weerasekera, Ka Fai Chang, Jong-Kai Lin, Vempati Srinivasa Rao, Surya Bhattacharya IEEE Design & Test