S. B. Nair Gourikutty et al., "A Compact Wafer-Level Heterogeneously Integrated Scalable Optical Transceiver for Data Centers," 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, CO, USA, 2024, pp. 1398-1403, doi: 10.1109/ECTC51529.2024.00228.
Abstract:
We present a compact heterogeneously integrated optical transceiver package with very low interconnect loss for hyper-scale data center applications realized through 300mm wafer-level packaging. It facilitates the integration of various electronic and photonic components, each independently optimized through diverse technologies, within a unified package platform
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Publisher Copyright
Funding Info:
This research / project is supported by the Agency for Science, Technology and Research (A*STAR) - Scalable Electronics-Photonics Integration enabled by Advanced Packaging for Optical Engine development
Grant Reference no. : Grant No. I2001E0071
This research / project is supported by the Agency for Science, Technology and Research (A*STAR) - Applied Centre of Excellence in Advanced Packaging 3.0
Grant Reference no. : Grant No. I2101E0008