A Compact Wafer-Level Heterogeneously Integrated Scalable Optical Transceiver for Data Centers

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A Compact Wafer-Level Heterogeneously Integrated Scalable Optical Transceiver for Data Centers
Title:
A Compact Wafer-Level Heterogeneously Integrated Scalable Optical Transceiver for Data Centers
Journal Title:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
Publication Date:
26 June 2024
Citation:
S. B. Nair Gourikutty et al., "A Compact Wafer-Level Heterogeneously Integrated Scalable Optical Transceiver for Data Centers," 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, CO, USA, 2024, pp. 1398-1403, doi: 10.1109/ECTC51529.2024.00228.
Abstract:
We present a compact heterogeneously integrated optical transceiver package with very low interconnect loss for hyper-scale data center applications realized through 300mm wafer-level packaging. It facilitates the integration of various electronic and photonic components, each independently optimized through diverse technologies, within a unified package platform
License type:
Publisher Copyright
Funding Info:
This research / project is supported by the Agency for Science, Technology and Research (A*STAR) - Scalable Electronics-Photonics Integration enabled by Advanced Packaging for Optical Engine development
Grant Reference no. : Grant No. I2001E0071

This research / project is supported by the Agency for Science, Technology and Research (A*STAR) - Applied Centre of Excellence in Advanced Packaging 3.0
Grant Reference no. : Grant No. I2101E0008
Description:
© 2024 IEEE.  Personal use of this material is permitted.  Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
ISSN:
2377-5726
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