Search results

Publication date Communities Collections Article title Author(s) Journal/Conference
26 Jun 2024 SERC Institute of Microelectronics A Compact Wafer-Level Heterogeneously Integrated Scalable Optical Transceiver for Data Centers Sajay Bhuvanendran Nair Gourikutty, Jiaqi Wu, Teck Guan Lim, San Sandra, Ming Chinq Jong, Chia Lai Yee, Lau Boon Long, David Soon Wee Ho, Chong Ser Choong, Ding Liang, Xiaoguang Tu, Wanjun Wang, Chee-Keong Tan, Alison See, Hsiu-Che Wang, Roberto Coccioli, Ronson Tan, Radhakrishnan Nagarajan, Surya Bhattacharya 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
18 Mar 2024 SERC Institute of Microelectronics Wafer Level Fabrication of Embedded Silicon Microcooler on Heating Devices Lau Boon Long, Javier Ong, Jason Au, Jong Ming Chinq, Zhang Xiaowu, Feng Huicheng 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
3 Aug 2023 SERC Institute of Microelectronics 3D Stacking of Heterogeneous Chiplets on Modified FOWLP Platform with Thru-Silicon Redistribution Layer Chai Tai Chong, Lau Boon Long, Sharon Lim Pei Siang, David Ho Soon Wee, Rob van Kampen, Paul Castillou, Roberto Gaddi, Lance Barron, Mickael Renault, Jay Ko, Jonathan Hammond 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres Sajay Bhuvanendran Nair Gourikutty, Lau Boon Long, Seit Wen Wei, Ming Chinq Jong, David Soon Wee Ho, Jiaqi Wu, Teck Guan Lim, Rathin Mandal, Chong Ser Choong, Chia Lai Yee, Xin Li, Jason Tsung-Yang Liow, Surya Bhattacharya 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
5 Jan 2022 SERC Institute of Microelectronics Fabrication Process Flow of Antenna-in-Package Fan-out Wafer Level Packaging Lau Boon Long, David Ho, Lim Teck Guan, Hsiao Hsiang Yao, Lim Pei Siang, Norhanani Jaafar 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
1 May 2015 SERC Institute of Microelectronics Package-Level Microjet-Based Hotspot Cooling Solution for Microelectronic Devices Yong Han, Lau Boon Long, Zhang Xiaowu IEEE Electron Device Letters