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3 Aug 2023
SERC
Institute for Infocomm Research
3D Defect Detection and Metrology of HBMs using Semi-Supervised Deep Learning
(Pending publish)
Ramanpreet Singh Pahwa,
Richard Chang,
Wang Jie,
Zhao Ziyuan,
Cai Lile,
Xu Xun,
Foo Chuan Sheng,
Chong Ser Choong,
Vempati Srinivasa Rao
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
12 Jul 2022
SERC
Institute for Infocomm Research
Automated Detection and Segmentation of HBMs in 3D X-ray Images using Semi-Supervised Deep Learning
Ramanpreet Singh Pahwa,
Richard Chang,
Wang Jie,
Xu Xun,
Oo Zaw Min,
Foo Chuan Sheng,
Chong Ser Choong,
Vempati Srinivasa Rao
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
5 Jan 2022
SERC
Institute of Microelectronics
Comprehensive Study on Thermal Aging and Ball Shear Characterization of SAC-X Solders
Norhanani Binte Jaafar,
Chong Ser Choong,
Sharon Lim Pei Siang,
Chai Tai Chong
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022
SERC
Institute of Microelectronics
Realization of High Aspect Ratio Through Mold Interconnect (TMI) using Vertical Wire
Leong Ching Wai,
David Ho Soon Wee,
Chong Ser Choong
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
10 Aug 2021
SERC
Institute of Microelectronics
Heterogeneous Integration with Embedded Fine Interconnect
Chai Tai Chong,
Lim Teck Guan,
David Ho,
Han Yong,
Chong Ser Choong,
Sharon Lim Pei Siang,
Surya Bhattacharya
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
30 May 2017
SERC
Institute of Microelectronics
Process and Reliability of Large Fan-Out Wafer Level Package based Package-on-Package
Sharon PS Lim,
Daniel Ismael,
Ye Yong Liang,
Vempati Srinivasa Rao,
Chai Tai Chong,
David Ho,
Ding Mian Zhi,
Chong Ser Choong
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
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