| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 5 Jan 2022 | SERC | Institute of Microelectronics | Towards Heterogeneous Integrated Electronic-Photonic Packages for Hyperscale Data Centers | Sajay Bhuvanendran Nair Gourikutty, Ming Chinq Jong, Chockanathan Vinoth Kanna, David Soon Wee Ho, Jiaqi Wu, Rathin Mandal, Nanxi Li, Teck Guan Lim, Jason Tsung-Yang Liow, Surya Bhattacharya | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |
| 10 Aug 2021 | SERC | Institute of Microelectronics | Addressing Warpage Issue and Reliability Challenge of Fan-out Wafer-Level Packaging (FOWLP) | Xiaowu Zhang, Boon Long Lau, Yong Han, Haoran Chen, Ming Chinq Jong, Sharon Pei Siang Lim, Simon Siak Boon Lim, Xiaobai Wang, Yosephine Andriani, Songlin Liu | 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) |