Gourikutty, S. B. N., Jong, M. C., Kanna, C. V., Ho, D. S. W., Wu, J., Mandal, R., Li, N., Lim, T. G., Liow, J. T.-Y., & Bhattacharya, S. (2021). Towards Heterogeneous Integrated Electronic-Photonic Packages for Hyperscale Data Centers. 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC). https://doi.org/10.1109/eptc53413.2021.9663971
There is an explosion in the volume of data generated, transmitted, processed, and stored across the internet after the wide usage of smartphones, high-performance computing, internet-of-things, and cloud services. To handle such data, high-performance optical transceivers are required. In this paper, a novel electronic-photonic heterogeneous integration solution based on fan-out wafer-level packaging which can be used for high-speed scalable optical engine is discussed. The packaged interconnects are optimized to handle high-speed signals for data center applications and the optical engine package is examined for warpage behavior. The photonic integrated circuit equipped with edge suspended coupler optical I/Os is integrated by employing special processing.
This research / project is supported by the Agency for Science, Technology and Research - Industry Alignment Fund – Industry Collaboration Project (IAF-ICP)
Grant Reference no. : I2001E0071