Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
---|---|---|---|---|---|
5 Jan 2022 | SERC | Institute of Microelectronics | SAW Cavity Sealing using Dielectric film in Wafer-level packaging | Chockanathan Vinoth Kanna, Soon Wee Ho | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |
5 Jan 2022 | SERC | Institute of Microelectronics | Towards Heterogeneous Integrated Electronic-Photonic Packages for Hyperscale Data Centers | Sajay Bhuvanendran Nair Gourikutty, Ming Chinq Jong, Chockanathan Vinoth Kanna, David Soon Wee Ho, Jiaqi Wu, Rathin Mandal, Nanxi Li, Teck Guan Lim, Jason Tsung-Yang Liow, Surya Bhattacharya | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |
5 Jan 2022 | SERC | Institute of Microelectronics | High Density Redistribution Layers (< 2 µm L/S) for Chiplets Packaging | Soon Wee Ho, Chockanathan Vinoth Kanna, Jong Ming Chinq, Chai Tai Chong | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |