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Publication date Communities Collections Article title Author(s) Journal/Conference
5 Jan 2022 SERC Institute of Microelectronics Mechanical modeling study for fan-out wafer level package parameters to enhance BGA TCoB life Rathin Mandal, Chai Tai Chong 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics High Density Redistribution Layers (< 2 µm L/S) for Chiplets Packaging Soon Wee Ho, Chockanathan Vinoth Kanna, Jong Ming Chinq, Chai Tai Chong 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Comprehensive Study on Thermal Aging and Ball Shear Characterization of SAC-X Solders Norhanani Binte Jaafar, Chong Ser Choong, Sharon Lim Pei Siang, Chai Tai Chong 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
10 Aug 2021 SERC Institute of Microelectronics Heterogeneous Integration with Embedded Fine Interconnect Chai Tai Chong, Lim Teck Guan, David Ho, Han Yong, Chong Ser Choong, Sharon Lim Pei Siang, Surya Bhattacharya 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
30 May 2017 SERC Institute of Microelectronics Process and Reliability of Large Fan-Out Wafer Level Package based Package-on-Package Sharon PS Lim, Daniel Ismael, Ye Yong Liang, Vempati Srinivasa Rao, Chai Tai Chong, David Ho, Ding Mian Zhi, Chong Ser Choong 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)