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Publication date Communities Collections Article title Author(s) Journal/Conference
18 Mar 2024 SERC Institute of Microelectronics Process and Integration Challenges for Via Last TSV (from top) on Functional LNA SOI wafers for 3D Heterogeneous chiplet integration Xiangyu Wang, Mihai Dragos Rotaru, Yu Haitao, Mingchinq Jonq, Chai Tai Chong, King-Jien Chui 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
3 Aug 2023 SERC Institute of Microelectronics 3D Stacking of Heterogeneous Chiplets on Modified FOWLP Platform with Thru-Silicon Redistribution Layer Chai Tai Chong, Lau Boon Long, Sharon Lim Pei Siang, David Ho Soon Wee, Rob van Kampen, Paul Castillou, Roberto Gaddi, Lance Barron, Mickael Renault, Jay Ko, Jonathan Hammond 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics Board level FEA reliability and stress modeling for chip-to-wafer bonded chiplet package Rathin Mandal, Chai Tai Chong 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics Design and Analysis of 3D Heterogeneous Chiplet Stack for RF Front-End Module Minituarization Mihai Dragos Rotaru, Shashank Tiwari, Paul Castillou, Chai Tai Chong, Chui King Jien 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
5 Jan 2022 SERC Institute of Microelectronics Mechanical modeling study for fan-out wafer level package parameters to enhance BGA TCoB life Rathin Mandal, Chai Tai Chong 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics High Density Redistribution Layers (< 2 µm L/S) for Chiplets Packaging Soon Wee Ho, Chockanathan Vinoth Kanna, Jong Ming Chinq, Chai Tai Chong 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Comprehensive Study on Thermal Aging and Ball Shear Characterization of SAC-X Solders Norhanani Binte Jaafar, Chong Ser Choong, Sharon Lim Pei Siang, Chai Tai Chong 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
10 Aug 2021 SERC Institute of Microelectronics Heterogeneous Integration with Embedded Fine Interconnect Chai Tai Chong, Lim Teck Guan, David Ho, Han Yong, Chong Ser Choong, Sharon Lim Pei Siang, Surya Bhattacharya 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
30 May 2017 SERC Institute of Microelectronics Process and Reliability of Large Fan-Out Wafer Level Package based Package-on-Package Sharon PS Lim, Daniel Ismael, Ye Yong Liang, Vempati Srinivasa Rao, Chai Tai Chong, David Ho, Ding Mian Zhi, Chong Ser Choong 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)