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18 Mar 2024
SERC
Institute of Microelectronics
Process and Integration Challenges for Via Last TSV (from top) on Functional LNA SOI wafers for 3D Heterogeneous chiplet integration
Xiangyu Wang,
Mihai Dragos Rotaru,
Yu Haitao,
Mingchinq Jonq,
Chai Tai Chong,
King-Jien Chui
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
3 Aug 2023
SERC
Institute of Microelectronics
3D Stacking of Heterogeneous Chiplets on Modified FOWLP Platform with Thru-Silicon Redistribution Layer
Chai Tai Chong,
Lau Boon Long,
Sharon Lim Pei Siang,
David Ho Soon Wee,
Rob van Kampen,
Paul Castillou,
Roberto Gaddi,
Lance Barron,
Mickael Renault,
Jay Ko,
Jonathan Hammond
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023
SERC
Institute of Microelectronics
Board level FEA reliability and stress modeling for chip-to-wafer bonded chiplet package
Rathin Mandal,
Chai Tai Chong
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023
SERC
Institute of Microelectronics
Design and Analysis of 3D Heterogeneous Chiplet Stack for RF Front-End Module Minituarization
Mihai Dragos Rotaru,
Shashank Tiwari,
Paul Castillou,
Chai Tai Chong,
Chui King Jien
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
5 Jan 2022
SERC
Institute of Microelectronics
Mechanical modeling study for fan-out wafer level package parameters to enhance BGA TCoB life
Rathin Mandal,
Chai Tai Chong
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022
SERC
Institute of Microelectronics
High Density Redistribution Layers (< 2 µm L/S) for Chiplets Packaging
Soon Wee Ho,
Chockanathan Vinoth Kanna,
Jong Ming Chinq,
Chai Tai Chong
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022
SERC
Institute of Microelectronics
Comprehensive Study on Thermal Aging and Ball Shear Characterization of SAC-X Solders
Norhanani Binte Jaafar,
Chong Ser Choong,
Sharon Lim Pei Siang,
Chai Tai Chong
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
10 Aug 2021
SERC
Institute of Microelectronics
Heterogeneous Integration with Embedded Fine Interconnect
Chai Tai Chong,
Lim Teck Guan,
David Ho,
Han Yong,
Chong Ser Choong,
Sharon Lim Pei Siang,
Surya Bhattacharya
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
30 May 2017
SERC
Institute of Microelectronics
Process and Reliability of Large Fan-Out Wafer Level Package based Package-on-Package
Sharon PS Lim,
Daniel Ismael,
Ye Yong Liang,
Vempati Srinivasa Rao,
Chai Tai Chong,
David Ho,
Ding Mian Zhi,
Chong Ser Choong
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
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