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5 Jan 2022
SERC
Institute of Microelectronics
Mechanical modeling study for fan-out wafer level package parameters to enhance BGA TCoB life
Rathin Mandal,
Chai Tai Chong
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022
SERC
Institute of Microelectronics
High Density Redistribution Layers (< 2 µm L/S) for Chiplets Packaging
Soon Wee Ho,
Chockanathan Vinoth Kanna,
Jong Ming Chinq,
Chai Tai Chong
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022
SERC
Institute of Microelectronics
Comprehensive Study on Thermal Aging and Ball Shear Characterization of SAC-X Solders
Norhanani Binte Jaafar,
Chong Ser Choong,
Sharon Lim Pei Siang,
Chai Tai Chong
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
10 Aug 2021
SERC
Institute of Microelectronics
Heterogeneous Integration with Embedded Fine Interconnect
Chai Tai Chong,
Lim Teck Guan,
David Ho,
Han Yong,
Chong Ser Choong,
Sharon Lim Pei Siang,
Surya Bhattacharya
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
30 May 2017
SERC
Institute of Microelectronics
Process and Reliability of Large Fan-Out Wafer Level Package based Package-on-Package
Sharon PS Lim,
Daniel Ismael,
Ye Yong Liang,
Vempati Srinivasa Rao,
Chai Tai Chong,
David Ho,
Ding Mian Zhi,
Chong Ser Choong
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
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