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Publication date Communities Collections Article title Author(s) Journal/Conference
3 Aug 2023 SERC Institute of Microelectronics Lead frame vs. mold via Rathin Mandal 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres Sajay Bhuvanendran Nair Gourikutty, Lau Boon Long, Seit Wen Wei, Ming Chinq Jong, David Soon Wee Ho, Jiaqi Wu, Teck Guan Lim, Rathin Mandal, Chong Ser Choong, Chia Lai Yee, Xin Li, Jason Tsung-Yang Liow, Surya Bhattacharya 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics Board level FEA reliability and stress modeling for chip-to-wafer bonded chiplet package Rathin Mandal, Chai Tai Chong 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
5 Jan 2022 SERC Institute of Microelectronics Towards Heterogeneous Integrated Electronic-Photonic Packages for Hyperscale Data Centers Sajay Bhuvanendran Nair Gourikutty, Ming Chinq Jong, Chockanathan Vinoth Kanna, David Soon Wee Ho, Jiaqi Wu, Rathin Mandal, Nanxi Li, Teck Guan Lim, Jason Tsung-Yang Liow, Surya Bhattacharya 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Mechanical modeling study for fan-out wafer level package parameters to enhance BGA TCoB life Rathin Mandal, Chai Tai Chong 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)