A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres

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A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres
Title:
A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres
Journal Title:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
Keywords:
Publication Date:
03 August 2023
Citation:
Nair Gourikutty, S. B., Long, L. B., Wei, S. W., Jong, M. C., Wee Ho, D. S., Wu, J., Lim, T. G., Mandal, R., Choong, C. S., Yee, C. L., Li, X., Liow, J. T.-Y., & Bhattacharya, S. (2023, May). A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres. 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC). https://doi.org/10.1109/ectc51909.2023.00043
Abstract:
The amount of IP traffic in data centers has been doubling approximately every 2–3 years and high-performance optical transceivers are required to handle such data. We propose a heterogeneous packaging of Optical Engines with edge optical coupling for hyper-scale data center application demonstrated using an 800Gbps test vehicle. This platform allows the integration of ICs from diverse technologies such as CMOS, SiGe, SOI, III-V, etc. in small form factor, through wafer-scale electronics-photonics packaging on 300mm wafers. The package offers short electrical interconnects between the photonic integrated circuit and electronic integrated circuit components and the package substrate with minimal signal loss. This high-performance compact OE can be integrated with Application Specific Integrated Circuits, making the package suitable for use in hyper-scale data centres and high-performance computing applications.
License type:
Publisher Copyright
Funding Info:
This research / project is supported by the A*STAR - Scalable Electronics-Photonics Integration enabled by Advanced Packaging
Grant Reference no. : I2001E0071
Description:
© 2023 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
ISSN:
2377-5726
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