A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres

A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

10.1109/ECTC51909.2023.00043

http://dx.doi.org/10.1109/ectc51909.2023.00043

Sajay Bhuvanendran Nair Gourikutty, Lau Boon Long, Seit Wen Wei, Ming Chinq Jong, David Soon Wee Ho, Jiaqi Wu, Teck Guan Lim, Rathin Mandal, Chong Ser Choong, Chia Lai Yee, Xin Li, Jason Tsung-Yang Liow, Surya Bhattacharya

03 August 2023

Nair Gourikutty, S. B., Long, L. B., Wei, S. W., Jong, M. C., Wee Ho, D. S., Wu, J., Lim, T. G., Mandal, R., Choong, C. S., Yee, C. L., Li, X., Liow, J. T.-Y., & Bhattacharya, S. (2023, May). A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres. 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC). https://doi.org/10.1109/ectc51909.2023.00043

The amount of IP traffic in data centers has been doubling approximately every 2–3 years and high-performance optical transceivers are required to handle such data. We propose a heterogeneous packaging of Optical Engines with edge optical coupling for hyper-scale data center application demonstrated using an 800Gbps test vehicle. This platform allows the integration of ICs from diverse technologies such as CMOS, SiGe, SOI, III-V, etc. in small form factor, through wafer-scale electronics-photonics packaging on 300mm wafers. The package offers short electrical interconnects between the photonic integrated circuit and electronic integrated circuit components and the package substrate with minimal signal loss. This high-performance compact OE can be integrated with Application Specific Integrated Circuits, making the package suitable for use in hyper-scale data centres and high-performance computing applications.

Publisher Copyright

This research / project is supported by the A*STAR - Scalable Electronics-Photonics Integration enabled by Advanced Packaging
Grant Reference no. : I2001E0071

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https://oar.a-star.edu.sg/communities-collections/articles/20251

2377-5726

Institute of Microelectronics