Collapse

Search results

Publication date Communities Collections Article title Author(s) Journal/Conference
5 Jan 2022 SERC Institute of Microelectronics Nonlinear Thermal Stress/Strain Analyses of Through SiC Via C.L. Alan Lee, Xiaowu Zhang, Haoran Chen 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
10 Aug 2021 SERC Institute of Microelectronics Development of a Novel Lead Frame Based Double Side Liquid Cooling High Performance SiC Power Module Gongyue Tang, Leong Ching Wai, Siak Boon Lim, Yong Liang Ye, Boon Long Lau, Kazunori Yamamoto, Xiaowu Zhang 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021 SERC Institute of Microelectronics Addressing Warpage Issue and Reliability Challenge of Fan-out Wafer-Level Packaging (FOWLP) Xiaowu Zhang, Boon Long Lau, Yong Han, Haoran Chen, Ming Chinq Jong, Sharon Pei Siang Lim, Simon Siak Boon Lim, Xiaobai Wang, Yosephine Andriani, Songlin Liu 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
13 Apr 2020 SERC Institute of Microelectronics A Dynamic Control System for Server Processor Direct Liquid Cooling Haoran Chen, Yong Han, Gongyue Tang, Xiaowu Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology
8 Aug 2019 SERC Institute of Microelectronics Si Microfluid Cooler With Jet-Slot Array for Server Processor Direct Liquid Cooling Yong Han, Boon Long Lau, Gongyue Tang, Haoran Chen, Xiaowu Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology
1 May 2019 SERC Institute of Microelectronics Thermal Optimization and Characterization of SiC-Based High Power Electronics Packages With Advanced Thermal Design Gongyue Tang, Tai Chong Chai, Xiaowu Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology
1 Jan 2017 SERC Institute of Microelectronics Si-Based Hybrid Microcooler With Multiple Drainage Microtrenches for High Heat Flux Cooling Yong Han, Boon Long Lau, Gongyue Tang, Xiaowu Zhang, Min Woo Rhee IEEE Transactions on Components, Packaging and Manufacturing Technology
7 Apr 2016 SERC Institute of Microelectronics Development of a Compact and Efficient Liquid Cooling System With Silicon Microcooler for High-Power Microelectronic Devices Gongyue Tang, Boon Long Lau, Xiaowu Zhang, Daniel Min Woo Rhee IEEE Transactions on Components, Packaging and Manufacturing Technology
18 Jan 2016 SERC Institute of Microelectronics Design Optimization and Characterization of Silicon Microcooler System through Finite Element Modeling and Experimental Analyses Fa Xing Che, Yong Han, Boon Long Lau, Xiaowu Zhang IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY
8 Dec 2015 SERC Institute of Microelectronics Thermal Management of Hotspots Using Diamond Heat Spreader on Si Microcooler for GaN Devices Yong Han, Boon Long Lau, Gongyue Tang, Xiaowu Zhang Components, Packaging and Manufacturing Technology, IEEE Transactions on