Search results

Publication date Communities Collections Article title Author(s) Journal/Conference
12 Nov 2025 SERC Institute of Microelectronics Two-phase Liquid Cooling of Vertically Stacked High-Power Chips with Backside-Embedded Micro-Pin Fins (Pending publish) Huicheng Feng, Gongyue Tang, Xiaowu Zhang, Boon Long Lau, Ming Chinq Jong IEEE Transactions on Components, Packaging and Manufacturing Technology
4 Sep 2025 SERC Institute of Microelectronics Investigation of coolant-dependent thermal performance in backside-embedded micro-pin fin arrays for high-power microelectronics cooling Huicheng Feng, Gongyue Tang, Xiaowu Zhang International Journal of Thermal Sciences
26 Jun 2024 SERC Institute of Microelectronics Embedded Liquid Cooling of High-Power Microelectronics Using Liquid Metal Huicheng Feng, Bin He, Gongyue Tang, Xiaowu Zhang, Boon Long Lau, Keng Yuen Jason Au, Jun Wei Javier Ong, Ming Chinq Jong 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
28 Feb 2024 SERC Institute of Microelectronics Two-Phase Liquid Cooling for High-Power Microelectronics via Embedded Micro-Pin Fin Heat Sink Huicheng Feng, Gongyue Tang, Xiaowu Zhang, Boon Long Lau, Ming Chinq Jong, Keng Yuen Jason Au, Jun Wei Javier Ong, King Jien Chui, Jun LI, Hongying Li, Duc Vinh Le, Jing Lou IEEE Transactions on Components, Packaging and Manufacturing Technology
30 Oct 2023 SERC Institute of High Performance Computing  Hybrid outflow boundary condition for the pseudopotential LBM simulation of flow boiling Jun LI, Duc-Vinh Le, Hongying Li, Xiaowu Zhang, Chang-Wei Kang, Jing Lou International Journal of Thermal Sciences
3 Aug 2023 SERC Institute of Microelectronics Embedded Micro-Pin Fin Heat Sink of Two-Phase Liquid Cooling for High Heat Flux 3D ICs Huicheng Feng, Gongyue Tang, Xiaowu Zhang, Boon Long Lau, Ming Chinq Jong, Keng Yuen Jason Au, King Jien Chui, Jing Lou, Hongying Li, Duc Vinh Le 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
5 Jan 2022 SERC Institute of Microelectronics Nonlinear Thermal Stress/Strain Analyses of Through SiC Via C.L. Alan Lee, Xiaowu Zhang, Haoran Chen 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
10 Aug 2021 SERC Institute of Microelectronics Development of a Novel Lead Frame Based Double Side Liquid Cooling High Performance SiC Power Module Gongyue Tang, Leong Ching Wai, Siak Boon Lim, Yong Liang Ye, Boon Long Lau, Kazunori Yamamoto, Xiaowu Zhang 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021 SERC Institute of Microelectronics Addressing Warpage Issue and Reliability Challenge of Fan-out Wafer-Level Packaging (FOWLP) Xiaowu Zhang, Boon Long Lau, Yong Han, Haoran Chen, Ming Chinq Jong, Sharon Pei Siang Lim, Simon Siak Boon Lim, Xiaobai Wang, Yosephine Andriani, Songlin Liu 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
13 Apr 2020 SERC Institute of Microelectronics A Dynamic Control System for Server Processor Direct Liquid Cooling Haoran Chen, Yong Han, Gongyue Tang, Xiaowu Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology