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Publication date Communities Collections Article title Author(s)
13 Apr 2020 SERC Institute of Microelectronics A Dynamic Control System for Server Processor Direct Liquid Cooling Haoran Chen, Yong Han, Gongyue Tang, Xiaowu Zhang
8 Aug 2019 SERC Institute of Microelectronics Si Microfluid Cooler With Jet-Slot Array for Server Processor Direct Liquid Cooling Yong Han, Boon Long Lau, Gongyue Tang, Haoran Chen, Xiaowu Zhang
1 May 2019 SERC Institute of Microelectronics Thermal Optimization and Characterization of SiC-Based High Power Electronics Packages With Advanced Thermal Design Gongyue Tang, Tai Chong Chai, Xiaowu Zhang
1 Jan 2017 SERC Institute of Microelectronics Si-Based Hybrid Microcooler With Multiple Drainage Microtrenches for High Heat Flux Cooling Yong Han, Boon Long Lau, Gongyue Tang, Xiaowu Zhang, Min Woo Rhee
7 Apr 2016 SERC Institute of Microelectronics Development of a Compact and Efficient Liquid Cooling System With Silicon Microcooler for High-Power Microelectronic Devices Gongyue Tang, Boon Long Lau, Xiaowu Zhang, Daniel Min Woo Rhee
18 Jan 2016 SERC Institute of Microelectronics Design Optimization and Characterization of Silicon Microcooler System through Finite Element Modeling and Experimental Analyses Fa Xing Che, Yong Han, Boon Long Lau, Xiaowu Zhang
8 Dec 2015 SERC Institute of Microelectronics Thermal Management of Hotspots Using Diamond Heat Spreader on Si Microcooler for GaN Devices Yong Han, Boon Long Lau, Gongyue Tang, Xiaowu Zhang
23 Jun 2015 SERC Institute of Microelectronics Heterogeneous 2.5D integration on through silicon interposer Xiaowu Zhang, Jong Kai Lin, Sunil Wickramanayaka, Songbai Zhang, Roshan Weerasekera, Rahul Dutta, Ka Fai Chang, King-Jien Chui, Hong Yu Li, David Ho, Liang Ding, Guruprasad Katti, Suryanarayana Bhattacharya, Dim-Lee Kwong
9 Jun 2015 SERC Institute of Microelectronics Heat Dissipation Capability of a Package-On-Package Embedded Wafer-Level Package Yong Han, Boon Long Lau, Yang Jung, Xiaowu Zhang
17 Dec 2014 SERC Institute of Microelectronics Characterization and Modeling of Fine-Pitch Copper Ball 4 Bonding on a Cu/Low-k Chip Xiaowu Zhang, T. C. Chai, Fa Xing Che, L. C. Wai
1 Aug 2014 SERC Institute of Microelectronics Investigation on Reliability of Embedded Ultrathin Sensor Chip in Organic Substrate Under Drop Impact Loading by Stresses Monitor and FEM Simulation Zhaohui Chen, Xiaowu Zhang
22 Jul 2014 SERC Institute of Microelectronics Thermal Management of Hotspots With a Microjet-Based Hybrid Heat Sink for GaN-on-Si Devices Yong Han, Boon Long Lau, Xiaowu Zhang, Yoke Choy Leong, Kok Fah Choo
16 Apr 2014 SERC Institute of Microelectronics Enhancement of Hotspot Cooling With Diamond Heat Spreader on Cu Microchannel Heat Sink for GaN-on-Si Device Yong Han, Boon Long Lau, Xiaowu Zhang, Yoke Choy Leong, Kok Fah Choo
1 Nov 2013 SERC Institute of Microelectronics Trapezoidal Microchannel Heat Sink With Pressure-Driven and Electro-Osmotic Flows for Microelectronic Cooling Yong Han, Yong Jiun Lee, Xiaowu Zhang
1 Oct 2013 SERC Institute of Microelectronics Investigation on Die Shift Issues in the 12-in Wafer-Level Compression Molding Process Lin Bu, Siowling Ho, Sorono Dexter Velez, Taichong Chai, Xiaowu Zhang