New Submission
Communities & Collections
FAQ
Login
Find journal articles, conference proceedings and datasets deposited in A*OAR
Collection
Please select a collection
Author
Topic
Funding info
Date published
Search
Clear
Search
Clear
Collapse
Home
Search
Search results
Publication date
Communities
Collections
Article title
Author(s)
Journal/Conference
18 Mar 2024
SERC
Institute of Microelectronics
Assembly process characterization of 3D Stacking of Heterogeneous Chiplets
Sharon Pei Siang Lim,
Boon Long Lau,
Tai Chong Chai,
Yong Liang Ye
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024
SERC
Institute of Microelectronics
Development of Large RDL Interposer Package using RDL-first FOWLP Process
Soon Wee Ho,
Siew Boon Soh,
Boon Long Lau,
Hsiao Hsiang-Yao,
Vempati Srinivasa Rao
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
28 Feb 2024
SERC
Institute of Microelectronics
Two-Phase Liquid Cooling for High-Power Microelectronics via Embedded Micro-Pin Fin Heat Sink
Huicheng Feng,
Gongyue Tang,
Xiaowu Zhang,
Boon Long Lau,
Ming Chinq Jong,
Keng Yuen Jason Au,
Jun Wei Javier Ong,
King Jien Chui,
Jun LI,
Hongying Li,
Duc Vinh Le,
Jing Lou
IEEE Transactions on Components, Packaging and Manufacturing Technology
3 Aug 2023
SERC
Institute of Microelectronics
Thermal Characterization and Management of GaN-on-SiC High Power Amplifier MMIC
Yong Han,
Gongyue Tang,
Boon Long Lau
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023
SERC
Institute of Microelectronics
Embedded Micro-Pin Fin Heat Sink of Two-Phase Liquid Cooling for High Heat Flux 3D ICs
Huicheng Feng,
Gongyue Tang,
Xiaowu Zhang,
Boon Long Lau,
Ming Chinq Jong,
Keng Yuen Jason Au,
King Jien Chui,
Jing Lou,
Hongying Li,
Duc Vinh Le
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
10 Aug 2021
SERC
Institute of Microelectronics
Development of a Novel Lead Frame Based Double Side Liquid Cooling High Performance SiC Power Module
Gongyue Tang,
Leong Ching Wai,
Siak Boon Lim,
Yong Liang Ye,
Boon Long Lau,
Kazunori Yamamoto,
Xiaowu Zhang
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021
SERC
Institute of Microelectronics
Addressing Warpage Issue and Reliability Challenge of Fan-out Wafer-Level Packaging (FOWLP)
Xiaowu Zhang,
Boon Long Lau,
Yong Han,
Haoran Chen,
Ming Chinq Jong,
Sharon Pei Siang Lim,
Simon Siak Boon Lim,
Xiaobai Wang,
Yosephine Andriani,
Songlin Liu
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
8 Aug 2019
SERC
Institute of Microelectronics
Si Microfluid Cooler With Jet-Slot Array for Server Processor Direct Liquid Cooling
Yong Han,
Boon Long Lau,
Gongyue Tang,
Haoran Chen,
Xiaowu Zhang
IEEE Transactions on Components, Packaging and Manufacturing Technology
30 May 2017
SERC
Institute of Microelectronics
Forming a vertical interconnect structure using dry film processing for Fan Out Wafer Level Packaging
Yew Wing Leong,
Hsiang-Yao Hsiao,
David Soon Wee Ho,
Boon Long Lau,
Huamao Lin
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
30 May 2017
SERC
Institute of Microelectronics
Package-level Si Micro-fluid Cooler with Enhanced Jet Array for High Performance 3D Systems
Yong Han,
Boon Long Lau,
Gongyue Tang,
Seow Meng Low,
Jason Goh
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
1
2
items per page
10
25
50
100