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Publication date Communities Collections Article title Author(s) Journal/Conference
12 Nov 2025 SERC Institute of Microelectronics Two-phase Liquid Cooling of Vertically Stacked High-Power Chips with Backside-Embedded Micro-Pin Fins Huicheng Feng, Gongyue Tang, Xiaowu Zhang, Boon Long Lau, Ming Chinq Jong IEEE Transactions on Components, Packaging and Manufacturing Technology
7 Nov 2024 SERC Institute of Microelectronics 1.6 Tbps FOWLP-Based Silicon Photonic Engine for Co-Packaged Optics Xin Li, Sajay Bhuvanendran Nair Gourikutty, Jiaqi Wu, Teck Guan Lim, Pengfei Guo, Jaye Charles Davies, Edward Sing Chee Koh, Boon Long Lau, Ming Chinq Jong, Ser Choong Chong, San Sandra, Chao Li, Guo-Qiang Lo, Surya Bhattacharya, Jason Tsung-Yang Liow Journal of Lightwave Technology
26 Jun 2024 SERC Institute of Microelectronics Embedded Liquid Cooling of High-Power Microelectronics Using Liquid Metal Huicheng Feng, Bin He, Gongyue Tang, Xiaowu Zhang, Boon Long Lau, Keng Yuen Jason Au, Jun Wei Javier Ong, Ming Chinq Jong 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
18 Mar 2024 SERC Institute of Microelectronics Assembly process characterization of 3D Stacking of Heterogeneous Chiplets Sharon Pei Siang Lim, Boon Long Lau, Tai Chong Chai, Yong Liang Ye 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024 SERC Institute of Microelectronics Development of Large RDL Interposer Package using RDL-first FOWLP Process Soon Wee Ho, Siew Boon Soh, Boon Long Lau, Hsiao Hsiang-Yao, Vempati Srinivasa Rao 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
28 Feb 2024 SERC Institute of Microelectronics Two-Phase Liquid Cooling for High-Power Microelectronics via Embedded Micro-Pin Fin Heat Sink Huicheng Feng, Gongyue Tang, Xiaowu Zhang, Boon Long Lau, Ming Chinq Jong, Keng Yuen Jason Au, Jun Wei Javier Ong, King Jien Chui, Jun LI, Hongying Li, Duc Vinh Le, Jing Lou IEEE Transactions on Components, Packaging and Manufacturing Technology
3 Aug 2023 SERC Institute of Microelectronics Thermal Characterization and Management of GaN-on-SiC High Power Amplifier MMIC Yong Han, Gongyue Tang, Boon Long Lau 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics Embedded Micro-Pin Fin Heat Sink of Two-Phase Liquid Cooling for High Heat Flux 3D ICs Huicheng Feng, Gongyue Tang, Xiaowu Zhang, Boon Long Lau, Ming Chinq Jong, Keng Yuen Jason Au, King Jien Chui, Jing Lou, Hongying Li, Duc Vinh Le 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
10 Aug 2021 SERC Institute of Microelectronics Development of a Novel Lead Frame Based Double Side Liquid Cooling High Performance SiC Power Module Gongyue Tang, Leong Ching Wai, Siak Boon Lim, Yong Liang Ye, Boon Long Lau, Kazunori Yamamoto, Xiaowu Zhang 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021 SERC Institute of Microelectronics Addressing Warpage Issue and Reliability Challenge of Fan-out Wafer-Level Packaging (FOWLP) Xiaowu Zhang, Boon Long Lau, Yong Han, Haoran Chen, Ming Chinq Jong, Sharon Pei Siang Lim, Simon Siak Boon Lim, Xiaobai Wang, Yosephine Andriani, Songlin Liu 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)