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10 Aug 2021
SERC
Institute of Microelectronics
Development of a Novel Lead Frame Based Double Side Liquid Cooling High Performance SiC Power Module
Gongyue Tang,
Leong Ching Wai,
Siak Boon Lim,
Yong Liang Ye,
Boon Long Lau,
Kazunori Yamamoto,
Xiaowu Zhang
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021
SERC
Institute of Microelectronics
Addressing Warpage Issue and Reliability Challenge of Fan-out Wafer-Level Packaging (FOWLP)
Xiaowu Zhang,
Boon Long Lau,
Yong Han,
Haoran Chen,
Ming Chinq Jong,
Sharon Pei Siang Lim,
Simon Siak Boon Lim,
Xiaobai Wang,
Yosephine Andriani,
Songlin Liu
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
8 Aug 2019
SERC
Institute of Microelectronics
Si Microfluid Cooler With Jet-Slot Array for Server Processor Direct Liquid Cooling
Yong Han,
Boon Long Lau,
Gongyue Tang,
Haoran Chen,
Xiaowu Zhang
IEEE Transactions on Components, Packaging and Manufacturing Technology
30 May 2017
SERC
Institute of Microelectronics
Forming a vertical interconnect structure using dry film processing for Fan Out Wafer Level Packaging
Yew Wing Leong,
Hsiang-Yao Hsiao,
David Soon Wee Ho,
Boon Long Lau,
Huamao Lin
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
30 May 2017
SERC
Institute of Microelectronics
Package-level Si Micro-fluid Cooler with Enhanced Jet Array for High Performance 3D Systems
Yong Han,
Boon Long Lau,
Gongyue Tang,
Seow Meng Low,
Jason Goh
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
1 Jan 2017
SERC
Institute of Microelectronics
Si-Based Hybrid Microcooler With Multiple Drainage Microtrenches for High Heat Flux Cooling
Yong Han,
Boon Long Lau,
Gongyue Tang,
Xiaowu Zhang,
Min Woo Rhee
IEEE Transactions on Components, Packaging and Manufacturing Technology
7 Apr 2016
SERC
Institute of Microelectronics
Development of a Compact and Efficient Liquid Cooling System With Silicon Microcooler for High-Power Microelectronic Devices
Gongyue Tang,
Boon Long Lau,
Xiaowu Zhang,
Daniel Min Woo Rhee
IEEE Transactions on Components, Packaging and Manufacturing Technology
18 Jan 2016
SERC
Institute of Microelectronics
Design Optimization and Characterization of Silicon Microcooler System through Finite Element Modeling and Experimental Analyses
Fa Xing Che,
Yong Han,
Boon Long Lau,
Xiaowu Zhang
IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY
8 Dec 2015
SERC
Institute of Microelectronics
Thermal Management of Hotspots Using Diamond Heat Spreader on Si Microcooler for GaN Devices
Yong Han,
Boon Long Lau,
Gongyue Tang,
Xiaowu Zhang
Components, Packaging and Manufacturing Technology, IEEE Transactions on
9 Jun 2015
SERC
Institute of Microelectronics
Heat Dissipation Capability of a Package-On-Package Embedded Wafer-Level Package
Yong Han,
Boon Long Lau,
Yang Jung,
Xiaowu Zhang
Design & Test, IEEE
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