| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 18 Mar 2024 | SERC | Institute of Microelectronics | Characterization of Differential TMV Vertical Interconnects to 50GHz with Double Side Measurement | Wu Jiaqi, Lim Teck Guan, Jason Tsung-Yang Liow, Sajay Bhuvanendran Nair Gourikutty | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |
| 18 Mar 2024 | SERC | Institute of Microelectronics | Parasitic Surface Conduction Effect of TSV on Interconnection Performance in RF SOI for 2.5D Integration | Zhou Lin, Lim Teck Guan, Wu Jiaqi, Xu Feng, Jong Ming Chinq, Ng Yong Chyn | 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) |
| 5 Jan 2022 | SERC | Institute of Microelectronics | RF Performance Study of Through-Mold-Via (TMV) using L-2L De-Embedding Method | Wu Jiaqi, Li Kangrong, Lim Teck Guan | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |