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3 Aug 2023
SERC
Institute for Infocomm Research
3D Defect Detection and Metrology of HBMs using Semi-Supervised Deep Learning
(Pending publish)
Ramanpreet Singh Pahwa,
Richard Chang,
Wang Jie,
Zhao Ziyuan,
Cai Lile,
Xu Xun,
Foo Chuan Sheng,
Chong Ser Choong,
Vempati Srinivasa Rao
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
12 Jul 2022
SERC
Institute for Infocomm Research
Automated Detection and Segmentation of HBMs in 3D X-ray Images using Semi-Supervised Deep Learning
Ramanpreet Singh Pahwa,
Richard Chang,
Wang Jie,
Xu Xun,
Oo Zaw Min,
Foo Chuan Sheng,
Chong Ser Choong,
Vempati Srinivasa Rao
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
10 Aug 2021
SERC
Institute for Infocomm Research,
Institute of Microelectronics
Automated Void Detection in TSVs from 2D X-Ray Scans using Supervised Learning with 3D X-Ray Scans
Ramanpreet Singh Pahwa,
Saisubramaniam Gopalakrishnan,
Huang Su,
Ong Ee Ping,
Haiwen Dai,
David Ho Soon Wee,
Ren Qin,
Vempati Srinivasa Rao
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021
SERC
Institute for Infocomm Research,
Institute of Microelectronics
Automated Attribute Measurements of Buried Package Features in 3D X-ray Images using Deep Learning
Ramanpreet Singh Pahwa,
Ma Tin Lay Nwe,
Richard Chang,
Oo Zaw Min,
Wang Jie,
Saisubramaniam Gopalakrishnan,
David Ho Soon Wee,
Ren Qin,
Vempati Srinivasa Rao,
Haiwen Dai,
Jens Timo Neumann,
Ramani Pichumani,
Tom Gregorich
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
1 Dec 2020
SERC
Institute for Infocomm Research
MACHINE-LEARNING BASED METHODOLOGIES FOR 3D X-RAY MEASUREMENT, CHARACTERIZATION AND OPTIMIZATION FOR BURIED STRUCTURES IN ADVANCED IC PACKAGES
Ramanpreet Singh Pahwa,
Tin Lay Nwe,
Richard Chang,
Zaw Min,
Wang Jie,
Tom Gregorich,
David Ho,
Vempati Srinivasa Rao
International Wafer Level Packaging Conference (IWLPC)
30 May 2017
SERC
Institute of Microelectronics
Process and Reliability of Large Fan-Out Wafer Level Package based Package-on-Package
Sharon PS Lim,
Daniel Ismael,
Ye Yong Liang,
Vempati Srinivasa Rao,
Chai Tai Chong,
David Ho,
Ding Mian Zhi,
Chong Ser Choong
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
1 Aug 2015
SERC
Institute of Microelectronics
Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC–TSI)
Guruprasad Katti,
David Soon Wee Ho,
Hong Yu Li,
Rahul Dutta,
Roshan Weerasekera,
Ka Fai Chang,
Jong-Kai Lin,
Vempati Srinivasa Rao,
Surya Bhattacharya
IEEE Design & Test
1 Aug 2013
SERC
Institute of Microelectronics
Development of Package-on-Package Using Embedded Wafer-Level Package Approach
(Pending publish)
Ser Choong Chong,
David Ho Soon Wee,
Vempati Srinivasa Rao,
Nagendra Sekhar Vasarla
IEEE Transactions on Components, Packaging and Manufacturing Technology
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