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Publication date Communities Collections Article title Author(s) Journal/Conference
11 Mar 2025 SERC Institute of Microelectronics Fabrication of c-Si Pillars on Glass Substrates for Terahertz Dielectric Metasurfaces Using Glass-Silicon Direct Bonding Hemanth Kumar Cheemalamarri, B.S.S.Chandra Rao, Arvind Sundaram, Ho Sze Jye Jacky, Tee Soon Fong, Prakash Pitchappa, Nitin Muralidharan Nair, Navab Singh, Vempati Srinivasa Rao 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)
9 Dec 2024 SERC Institute of Microelectronics Low-Thermal Budget TEOS-TEOS Bonding for Multi-Stack HBM Applications Hemanth Kumar Cheemalamarri, Masahisa Fujino, Ji Hong Miao, Everline Teo, Vempati Srinivasa Rao, Navab Singh 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
26 Jun 2024 SERC Institute of Microelectronics Sub-0.5 μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bonding Hemanth Kumar Cheemalamarri, Arvind Sundaram, San Sandra, Tran Van Nhat Anh, Bhesetti Chandra Rao, Chen Gim Guan, Yu Haitao, Mani Raju, Luo Ping, Lee Chaeeun, Vempati Srinivasa Rao, Navab Singh 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
26 Jun 2024 SERC Institute of Microelectronics Cu/Dielectric hybrid bonding among Glass and Si Hemanth Kumar Cheemalamarri, Arvind Sundaram, Tran Van Nhat Anh, Yoo Jae Ok, Vempati Srinivasa Rao, Navab Singh 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
26 Jun 2024 SERC Institute of Microelectronics Process Challenges in Thin Wafers Fabrication with Double Side Hybrid Bond Pads for Chip Stacking Mishra Dileep Kumar, Vasarla Nagendra Sekhar, B.S.S. Chandra Rao, Ser Choong Chong, Vempati Srinivasa Rao 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
18 Mar 2024 SERC Institute of Microelectronics Reliability Assessment of 2.5D Module using Chip to Wafer Hybrid Bonding Ser Choong Chong, Jason Au Keng Yuen, Vasarla Nagendra Sekhar, Ismael Cereno Daniel, Mishra Dileep Kumar, Vempati Srinivasa Rao 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024 SERC Institute of Microelectronics Study of Cu Pad Expansion with Surrounding Dielectrics for Hybrid Bonding Hemanth Kumar Cheemalamarri, Ji Lir, Wen Lee, Vempati Srinivasa Rao, Navab Singh 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024 SERC Institute of Microelectronics Development of Large RDL Interposer Package using RDL-first FOWLP Process Soon Wee Ho, Siew Boon Soh, Boon Long Lau, Hsiao Hsiang-Yao, Vempati Srinivasa Rao 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
3 Aug 2023 SERC Institute of Microelectronics Development of PMUT Array Packaging from Characterisation Prototypes to Customer Samples Dominico Giusti, Alex Gritti, Fabio Quaglia, Alessandro Stuart Savoia, Hideyuki Sandoh, Gerald Klug, Hitoshi Hoshino, Dutta Rahul, Vempati Srinivasa Rao, David Ho Soon Wee, Masatoshi Wakahara, Mark Shaw 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics CMOS-Compatible Fine Pitch Al-Al Bonding Hemanth Kumar Cheemalamarri, Binni Varghese, Sharma Jaibir, Li Hongyu, Chandra Rao S S, Navab Singh, Vempati Srinivasa Rao, King-Jien Chui 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)