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Publication date Communities Collections Article title Author(s) Journal/Conference
26 Jun 2024 SERC Institute of Microelectronics Process Challenges in Thin Wafers Fabrication with Double Side Hybrid Bond Pads for Chip Stacking Mishra Dileep Kumar, Vasarla Nagendra Sekhar, B.S.S. Chandra Rao, Ser Choong Chong, Vempati Srinivasa Rao 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
18 Mar 2024 SERC Institute of Microelectronics Reliability Assessment of 2.5D Module using Chip to Wafer Hybrid Bonding Ser Choong Chong, Jason Au Keng Yuen, Vasarla Nagendra Sekhar, Ismael Cereno Daniel, Mishra Dileep Kumar, Vempati Srinivasa Rao 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024 SERC Institute of Microelectronics Study of Cu Pad Expansion with Surrounding Dielectrics for Hybrid Bonding Hemanth Kumar Cheemalamarri, Ji Lir, Wen Lee, Vempati Srinivasa Rao, Navab Singh 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024 SERC Institute of Microelectronics Development of Large RDL Interposer Package using RDL-first FOWLP Process Soon Wee Ho, Siew Boon Soh, Boon Long Lau, Hsiao Hsiang-Yao, Vempati Srinivasa Rao 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
3 Aug 2023 SERC Institute of Microelectronics Development of PMUT Array Packaging from Characterisation Prototypes to Customer Samples Dominico Giusti, Alex Gritti, Fabio Quaglia, Alessandro Stuart Savoia, Hideyuki Sandoh, Gerald Klug, Hitoshi Hoshino, Dutta Rahul, Vempati Srinivasa Rao, David Ho Soon Wee, Masatoshi Wakahara, Mark Shaw 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics CMOS-Compatible Fine Pitch Al-Al Bonding Hemanth Kumar Cheemalamarri, Binni Varghese, Sharma Jaibir, Li Hongyu, Chandra Rao S S, Navab Singh, Vempati Srinivasa Rao, King-Jien Chui 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics Cu Damascene Process on Temporary Bonded Wafers for Thin Chip Stacking using Cu-Cu Hybrid Bonding Vasarla Nagendra Sekhar, Mishra Dileep Kumar, Prayudi Lianto, Ser Choong Chong, Vempati Srinivasa Rao 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics Development of 4 die stack module using Hybrid bonding approach Ser Choong Chong, Jason Au Keng Yuen, Vasarla Nagendra Sekhar, Ismael Cereno Daniel, Vempati Srinivasa Rao 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute for Infocomm Research 3D Defect Detection and Metrology of HBMs using Semi-Supervised Deep Learning Ramanpreet Singh Pahwa, Richard Chang, Wang Jie, Zhao Ziyuan, Cai Lile, Xu Xun, Foo Chuan Sheng, Chong Ser Choong, Vempati Srinivasa Rao 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
24 Jul 2023 SERC Institute of Microelectronics Multi-Chiplet Heterogeneous Integration Packaging for Semiconductor System Scaling Surya Bhattacharya, Vempati Srinivasa Rao 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)