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Publication date Communities Collections Article title Author(s) Journal/Conference
17 Jun 2026 SERC Institute of Microelectronics Vertical Interconnects Characterization for 448 Gbps/lane Co-Packaged Optics using Double-Sided Probing Method Jiaqi Wu, Sajay Bhuvanendran Nair Gourikutty, Teck Guan Lim, Surya Bhattacharya 2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
24 Feb 2026 SERC Institute of Microelectronics Backside Metal Interconnect for High Performance RF Interposer Teck Guan Lim, Eva Wai Leong Ching, Sasi Kumar Tippabhotla, Huicheng Feng, Jiaqi Wu 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
24 Feb 2026 SERC Institute of Microelectronics Rf and Digital Heterogenous Integration on 2.5D Si-Interposer Leong Ching Wai, Teck Guan Lim, Ser Choong Chong, Yong Chyn Ng, Vempati Srinivasa Rao 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
11 Mar 2025 SERC Institute of Microelectronics Thermal Design and Analysis of a Flip-Chip GaN-on-SiC HEMT Huicheng Feng, Lin Zhou, Gongyue Tang, Leong Ching Wai, Teck Guan Lim 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)
7 Nov 2024 SERC Institute of Microelectronics 1.6 Tbps FOWLP-Based Silicon Photonic Engine for Co-Packaged Optics Xin Li, Sajay Bhuvanendran Nair Gourikutty, Jiaqi Wu, Teck Guan Lim, Pengfei Guo, Jaye Charles Davies, Edward Sing Chee Koh, Boon Long Lau, Ming Chinq Jong, Ser Choong Chong, San Sandra, Chao Li, Guo-Qiang Lo, Surya Bhattacharya, Jason Tsung-Yang Liow Journal of Lightwave Technology
26 Jun 2024 SERC Institute of Microelectronics A Compact Wafer-Level Heterogeneously Integrated Scalable Optical Transceiver for Data Centers Sajay Bhuvanendran Nair Gourikutty, Jiaqi Wu, Teck Guan Lim, San Sandra, Ming Chinq Jong, Chia Lai Yee, Lau Boon Long, David Soon Wee Ho, Chong Ser Choong, Ding Liang, Xiaoguang Tu, Wanjun Wang, Chee-Keong Tan, Alison See, Hsiu-Che Wang, Roberto Coccioli, Ronson Tan, Radhakrishnan Nagarajan, Surya Bhattacharya 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
1 Apr 2024 SERC Institute of Microelectronics 77-GHz FOWLP MIMO AiP for Compact High-Resolution Radar With Horizontally and Vertically Long- and Medium-Range Sensing Mei Sun, Teck Guan Lim, David Soon Wee Ho, Jiaqi Wu, Tai Chong Chai, Yugang Ma IEEE Transactions on Components, Packaging and Manufacturing Technology
18 Mar 2024 SERC Institute of Microelectronics Development of Flip-Chip Packaging for Monolithic Microwave Integrated Circuit Leong Ching Wai, Teck Guan Lim, Ser Choong Chong, Lin Zhou 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
3 Aug 2023 SERC Institute of Microelectronics A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres Sajay Bhuvanendran Nair Gourikutty, Lau Boon Long, Seit Wen Wei, Ming Chinq Jong, David Soon Wee Ho, Jiaqi Wu, Teck Guan Lim, Rathin Mandal, Chong Ser Choong, Chia Lai Yee, Xin Li, Jason Tsung-Yang Liow, Surya Bhattacharya 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics High-Performance Amplifier Package Design for Heterogenous Integration on Si-interposer Teck Guan Lim, Lin Zho, Sasi Kumar Tippabhotla, Ji Lin, Jong Ming Chinq, Jiaqi Wu, Tang Gongyue, Eva Wai Leong Ching, Yong Chyn Ng, King Jien Chui, Wei Jia Lu, Chee Heng Goh, Sek Lin Pek, Jun Wei Agnes Loh 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)