Wai, L. C., Guan Lim, T., Chong, S. C., & Zhou, L. (2023, December 5). Development of Flip-Chip Packaging for Monolithic Microwave Integrated Circuit. 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC). https://doi.org/10.1109/eptc59621.2023.10457631
Abstract:
In this paper, the flip chip joints formed by using gold
(Au) stud on commercial-off-the shelf (COTS) monolithic microwave integrate circuit (MMIC) designed
for wire bond assembly are evaluated. This study demonstrated different interconnect joints
starting from chip level with Au stud
bumping as main core in these interconnect joints.
License type:
Publisher Copyright
Funding Info:
This research / project is supported by the National Research Foundation, Singapore - Through-SiC-Interposer Fabrication and Heterogeneous Integration Development (SHINE project)
Grant Reference no. : NA