| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 5 Jan 2022 | SERC | Institute of Microelectronics | Realization of High Aspect Ratio Through Mold Interconnect (TMI) using Vertical Wire | Leong Ching Wai, David Ho Soon Wee, Chong Ser Choong | 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |
| 10 Aug 2021 | SERC | Institute of Microelectronics | Development of a Novel Lead Frame Based Double Side Liquid Cooling High Performance SiC Power Module | Gongyue Tang, Leong Ching Wai, Siak Boon Lim, Yong Liang Ye, Boon Long Lau, Kazunori Yamamoto, Xiaowu Zhang | 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) |
| 1 Oct 2016 | SERC | Institute of Microelectronics | 3-D Modeling and Characterization for Die Attach Process | Siow Ling Ho, Min Woo Rhee, Puay Fen Yong, Bu Lin, Leong Ching Wai | IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY |