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Publication date Communities Collections Article title Author(s) Journal/Conference
18 Mar 2024 SERC Institute of Microelectronics Transient Thermal Characterization and Analysis for Next Generation SiC Power Module Gongyue Tang, Yong Liang Ye, Leong Ching Wai, Yong Han 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024 SERC Institute of Microelectronics Development of Flip-Chip Packaging for Monolithic Microwave Integrated Circuit Leong Ching Wai, Teck Guan Lim, Ser Choong Chong, Lin Zhou 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
18 Mar 2024 SERC Institute of Microelectronics Investigation of Void-free Chip-to-Chip Bonding Methods for CMOS-MEMS Compatibility Yi Xuan Yeo, Eva Leong Ching Wai, Daniel Ssu-Han Chen, Ser Choong Chong 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
9 Oct 2023 SERC Institute of Microelectronics MEMS-Silicon Chip Bonding Verification using GHz Pulse-echo Simulation and Measurements Shyam Trivedi, Yi Xuan Yeo, Mantalena Sarafianou, Eva Leong Ching Wai, Jaibir Sharma, Daniel Ssu-Han Chen, Amit Lal, Kevin Tshun Chuan Chai 2023 Joint Conference of the European Frequency and Time Forum and IEEE International Frequency Control Symposium (EFTF/IFCS)
3 Aug 2023 SERC Institute of Microelectronics Development and Demonstration of a Novel Immersion Two Phase Cooling High Power SiC Power Module Gongyue Tang, Leong Ching Wai, Huicheng Feng 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
5 Jan 2022 SERC Institute of Microelectronics Realization of High Aspect Ratio Through Mold Interconnect (TMI) using Vertical Wire Leong Ching Wai, David Ho Soon Wee, Chong Ser Choong 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
10 Aug 2021 SERC Institute of Microelectronics Development of a Novel Lead Frame Based Double Side Liquid Cooling High Performance SiC Power Module Gongyue Tang, Leong Ching Wai, Siak Boon Lim, Yong Liang Ye, Boon Long Lau, Kazunori Yamamoto, Xiaowu Zhang 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
1 Oct 2016 SERC Institute of Microelectronics 3-D Modeling and Characterization for Die Attach Process Siow Ling Ho, Min Woo Rhee, Puay Fen Yong, Bu Lin, Leong Ching Wai IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY