Rf and Digital Heterogenous Integration on 2.5D Si-Interposer

Rf and Digital Heterogenous Integration on 2.5D Si-Interposer

2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)

10.1109/EPTC67330.2025.11392145

https://doi.org/10.1109/eptc67330.2025.11392145

Leong Ching Wai, Teck Guan Lim, Ser Choong Chong, Yong Chyn Ng, Vempati Srinivasa Rao

General Materials Science

24 February 2026

Wai, L. C., Lim, T. G., Chong, S. C., Ng, Y. C., & Rao, V. S. (2025). Rf and Digital Heterogenous Integration on 2.5D Si-Interposer. In (Editor), 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC). https://doi.org/10.1109/eptc67330.2025.11392145

This study explores the assembly process for RF-digital integration with 2.5D through-silicon interposer technology., with a focus on evaluated on process approach, materials compatibility and thermal processing. Thin silicon interposer exhibit warpage during assembly processing, which can impact assembly accuracy. Despite these challenges, the full assembly process was successfully demonstrated.

Publisher Copyright

This research / project is supported by the Agency for Science, Technology and Research - Applied Centre of Excellence in Advanced Packaging 3.0
Grant Reference no. : I2101E0008

This research / project is supported by the National Research Foundation - Singapore Hybrid-Integrated Next-Generation μ-Electronics (SHINE) Centre funding programme
Grant Reference no. : NA

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