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Publication date Communities Collections Article title Author(s) Journal/Conference
1 Apr 2024 SERC Institute of Microelectronics 77-GHz FOWLP MIMO AiP for Compact High-Resolution Radar With Horizontally and Vertically Long- and Medium-Range Sensing Mei Sun, Teck Guan Lim, David Soon Wee Ho, Jiaqi Wu, Tai Chong Chai, Yugang Ma IEEE Transactions on Components, Packaging and Manufacturing Technology
18 Mar 2024 SERC Institute of Microelectronics Assembly process characterization of 3D Stacking of Heterogeneous Chiplets Sharon Pei Siang Lim, Boon Long Lau, Tai Chong Chai, Yong Liang Ye 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Through Mold Via Development Using Laser Drilling Process for 3D Fan-out Wafer Level Package Hsiang-Yao Hsiao, David Soon Wee Ho, Ser Choong Chong, Tai Chong Chai, David Schutzberger, Yariv Oz, Guy Amrani 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics A comparative study of stress-based and fracture mechanics-based finite element simulation approaches for RDL based wafer level package Sasi Kumar Tippabhotla, Lin Ji, Tai Chong Chai 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Addressing the assembly challenges of Antenna-in-package Sharon Pei Siang Lim, Ser Choong Chong, David Ho Soon Wee, Wen Wei Seit, Jacob Jordan Soh, Tai Chong Chai 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
10 Aug 2021 SERC Institute of Microelectronics AiP Component and Board Level Heat dissipation Analysis for Automotive Radar Yong Han, Tai Chong Chai, Sharon Seow Huang Lim 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021 SERC Institute of Microelectronics Reliability life assessment and prediction for high density FOWLP package using finite element analysis and statistical approach Lin Ji, Tai Chong Chai 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021 SERC Institute of Microelectronics Comprehensive Study of Thermal Impact on Warpage Behaviour of FOWLP with Different Die to Mold Ratio Ser Choong Chong, Simon Siak Boon Lim, Wen Wei Seit, Tai Chong Chai, Debbie Claire Sanchez 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021 SERC Institute for Infocomm Research FOWLP AiP Optimization for Automotive Radar Applications Mei Sun, Teck Guan Lim, Tai Chong Chai, Surya Bhattacharya, Yugang Ma 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
1 May 2019 SERC Institute of Microelectronics Thermal Optimization and Characterization of SiC-Based High Power Electronics Packages With Advanced Thermal Design Gongyue Tang, Tai Chong Chai, Xiaowu Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology