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Publication date Communities Collections Article title Author(s) Journal/Conference
5 Jan 2022 SERC Institute of Microelectronics Through Mold Via Development Using Laser Drilling Process for 3D Fan-out Wafer Level Package Hsiang-Yao Hsiao, David Soon Wee Ho, Ser Choong Chong, Tai Chong Chai, David Schutzberger, Yariv Oz, Guy Amrani 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics A comparative study of stress-based and fracture mechanics-based finite element simulation approaches for RDL based wafer level package Sasi Kumar Tippabhotla, Lin Ji, Tai Chong Chai 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Addressing the assembly challenges of Antenna-in-package Sharon Pei Siang Lim, Ser Choong Chong, David Ho Soon Wee, Wen Wei Seit, Jacob Jordan Soh, Tai Chong Chai 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
10 Aug 2021 SERC Institute of Microelectronics AiP Component and Board Level Heat dissipation Analysis for Automotive Radar Yong Han, Tai Chong Chai, Sharon Seow Huang Lim 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021 SERC Institute of Microelectronics Reliability life assessment and prediction for high density FOWLP package using finite element analysis and statistical approach Lin Ji, Tai Chong Chai 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021 SERC Institute of Microelectronics Comprehensive Study of Thermal Impact on Warpage Behaviour of FOWLP with Different Die to Mold Ratio Ser Choong Chong, Simon Siak Boon Lim, Wen Wei Seit, Tai Chong Chai, Debbie Claire Sanchez 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021 SERC Institute for Infocomm Research FOWLP AiP Optimization for Automotive Radar Applications Mei Sun, Teck Guan Lim, Tai Chong Chai, Surya Bhattacharya, Yugang Ma 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
1 May 2019 SERC Institute of Microelectronics Thermal Optimization and Characterization of SiC-Based High Power Electronics Packages With Advanced Thermal Design Gongyue Tang, Tai Chong Chai, Xiaowu Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology
30 May 2017 SERC Institute of Microelectronics Drop Impact Reliability Test and Failure Analysis for Large Size High Density FOWLP Package on Package Zhaohui Chen, Faxing Che, Mian Zhi Ding, David Soon Wee Ho, Tai Chong Chai, Vempati Srinivasa 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
1 Mar 2015 SERC Institute of Microelectronics Failure Mechanism for Fine Pitch Microbump in Cu/Sn/Cu System During Current Stressing Tai Chong Chai, Hsiang-Yao Hsiao, Alastair David Trigg IEEE Transactions on Components, Packaging and Manufacturing Technology