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5 Jan 2022
SERC
Institute of Microelectronics
Through Mold Via Development Using Laser Drilling Process for 3D Fan-out Wafer Level Package
Hsiang-Yao Hsiao,
David Soon Wee Ho,
Ser Choong Chong,
Tai Chong Chai,
David Schutzberger,
Yariv Oz,
Guy Amrani
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022
SERC
Institute of Microelectronics
A comparative study of stress-based and fracture mechanics-based finite element simulation approaches for RDL based wafer level package
Sasi Kumar Tippabhotla,
Lin Ji,
Tai Chong Chai
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022
SERC
Institute of Microelectronics
Addressing the assembly challenges of Antenna-in-package
Sharon Pei Siang Lim,
Ser Choong Chong,
David Ho Soon Wee,
Wen Wei Seit,
Jacob Jordan Soh,
Tai Chong Chai
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
10 Aug 2021
SERC
Institute of Microelectronics
AiP Component and Board Level Heat dissipation Analysis for Automotive Radar
Yong Han,
Tai Chong Chai,
Sharon Seow Huang Lim
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021
SERC
Institute of Microelectronics
Reliability life assessment and prediction for high density FOWLP package using finite element analysis and statistical approach
Lin Ji,
Tai Chong Chai
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021
SERC
Institute of Microelectronics
Comprehensive Study of Thermal Impact on Warpage Behaviour of FOWLP with Different Die to Mold Ratio
Ser Choong Chong,
Simon Siak Boon Lim,
Wen Wei Seit,
Tai Chong Chai,
Debbie Claire Sanchez
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021
SERC
Institute for Infocomm Research
FOWLP AiP Optimization for Automotive Radar Applications
Mei Sun,
Teck Guan Lim,
Tai Chong Chai,
Surya Bhattacharya,
Yugang Ma
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
1 May 2019
SERC
Institute of Microelectronics
Thermal Optimization and Characterization of SiC-Based High Power Electronics Packages With Advanced Thermal Design
Gongyue Tang,
Tai Chong Chai,
Xiaowu Zhang
IEEE Transactions on Components, Packaging and Manufacturing Technology
30 May 2017
SERC
Institute of Microelectronics
Drop Impact Reliability Test and Failure Analysis for Large Size High Density FOWLP Package on Package
Zhaohui Chen,
Faxing Che,
Mian Zhi Ding,
David Soon Wee Ho,
Tai Chong Chai,
Vempati Srinivasa
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
1 Mar 2015
SERC
Institute of Microelectronics
Failure Mechanism for Fine Pitch Microbump in Cu/Sn/Cu System During Current Stressing
Tai Chong Chai,
Hsiang-Yao Hsiao,
Alastair David Trigg
IEEE Transactions on Components, Packaging and Manufacturing Technology
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