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Publication date Communities Collections Article title Author(s) Journal/Conference
17 Jun 2026 SERC Institute of Microelectronics Vertical Interconnects Characterization for 448 Gbps/lane Co-Packaged Optics using Double-Sided Probing Method (Pending publish) Jiaqi Wu, Sajay Bhuvanendran Nair Gourikutty, Teck Guan Lim, Surya Bhattacharya 2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
24 Feb 2026 SERC Institute of Microelectronics Backside Metal Interconnect for High Performance RF Interposer (Pending publish) Teck Guan Lim, Eva Wai Leong Ching, Sasi Kumar Tippabhotla, Huicheng Feng, Jiaqi Wu 2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
15 Jan 2025 SERC Institute for Infocomm Research Fast tensor robust principal component analysis with estimated multi-rank and Riemannian optimization Qile Zhu, Shiqian Wu, Shun Fang, Qi Wu, Shoulie Xie, Sos Agaian Applied Intelligence
5 Dec 2024 SERC Institute for Infocomm Research Audio–Visual Segmentation based on robust principal component analysis Shun Fang, Qile Zhu, Qi Wu, Shiqian Wu, Shoulie Xie Expert Systems with Applications
7 Nov 2024 SERC Institute of Microelectronics 1.6 Tbps FOWLP-Based Silicon Photonic Engine for Co-Packaged Optics Xin Li, Sajay Bhuvanendran Nair Gourikutty, Jiaqi Wu, Teck Guan Lim, Pengfei Guo, Jaye Charles Davies, Edward Sing Chee Koh, Boon Long Lau, Ming Chinq Jong, Ser Choong Chong, San Sandra, Chao Li, Guo-Qiang Lo, Surya Bhattacharya, Jason Tsung-Yang Liow Journal of Lightwave Technology
26 Jun 2024 SERC Institute of Microelectronics A Compact Wafer-Level Heterogeneously Integrated Scalable Optical Transceiver for Data Centers Sajay Bhuvanendran Nair Gourikutty, Jiaqi Wu, Teck Guan Lim, San Sandra, Ming Chinq Jong, Chia Lai Yee, Lau Boon Long, David Soon Wee Ho, Chong Ser Choong, Ding Liang, Xiaoguang Tu, Wanjun Wang, Chee-Keong Tan, Alison See, Hsiu-Che Wang, Roberto Coccioli, Ronson Tan, Radhakrishnan Nagarajan, Surya Bhattacharya 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
2 Apr 2024 SERC Institute of Materials Research and Engineering Self-powered triboelectric nanogenerator with enhanced surface charge density for dynamic multidirectional pressure sensing Jiaqi Wu, Yu Zhang, Xin Ting Zheng Sensors & Diagnostics
1 Apr 2024 SERC Institute of Microelectronics 77-GHz FOWLP MIMO AiP for Compact High-Resolution Radar With Horizontally and Vertically Long- and Medium-Range Sensing Mei Sun, Teck Guan Lim, David Soon Wee Ho, Jiaqi Wu, Tai Chong Chai, Yugang Ma IEEE Transactions on Components, Packaging and Manufacturing Technology
15 Aug 2023 SERC Institute for Infocomm Research Model-Based Deep Learning for Low-Cost IMU Dead Reckoning of Wheeled Mobile Robot Fanghong Guo, Hao Yang, Xiang Wu, Hui Dong, Qi Wu, Zhengguo Li IEEE Transactions on Industrial Electronics
3 Aug 2023 SERC Institute of Microelectronics A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres Sajay Bhuvanendran Nair Gourikutty, Lau Boon Long, Seit Wen Wei, Ming Chinq Jong, David Soon Wee Ho, Jiaqi Wu, Teck Guan Lim, Rathin Mandal, Chong Ser Choong, Chia Lai Yee, Xin Li, Jason Tsung-Yang Liow, Surya Bhattacharya 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)