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5 Dec 2024
SERC
Institute for Infocomm Research
Audio–Visual Segmentation based on robust principal component analysis
Shun Fang,
Qile Zhu,
Qi Wu,
Shiqian Wu,
Shoulie Xie
Expert Systems with Applications
26 Jun 2024
SERC
Institute of Microelectronics
A Compact Wafer-Level Heterogeneously Integrated Scalable Optical Transceiver for Data Centers
Sajay Bhuvanendran Nair Gourikutty,
Jiaqi Wu,
Teck Guan Lim,
San Sandra,
Ming Chinq Jong,
Chia Lai Yee,
Lau Boon Long,
David Soon Wee Ho,
Chong Ser Choong,
Ding Liang,
Xiaoguang Tu,
Wanjun Wang,
Chee-Keong Tan,
Alison See,
Hsiu-Che Wang,
Roberto Coccioli,
Ronson Tan,
Radhakrishnan Nagarajan,
Surya Bhattacharya
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
2 Apr 2024
SERC
Institute of Materials Research and Engineering
Self-powered triboelectric nanogenerator with enhanced surface charge density for dynamic multidirectional pressure sensing
Jiaqi Wu,
Yu Zhang,
Xin Ting Zheng
Sensors & Diagnostics
1 Apr 2024
SERC
Institute of Microelectronics
77-GHz FOWLP MIMO AiP for Compact High-Resolution Radar With Horizontally and Vertically Long- and Medium-Range Sensing
Mei Sun,
Teck Guan Lim,
David Soon Wee Ho,
Jiaqi Wu,
Tai Chong Chai,
Yugang Ma
IEEE Transactions on Components, Packaging and Manufacturing Technology
15 Aug 2023
SERC
Institute for Infocomm Research
Model-Based Deep Learning for Low-Cost IMU Dead Reckoning of Wheeled Mobile Robot
Fanghong Guo,
Hao Yang,
Xiang Wu,
Hui Dong,
Qi Wu,
Zhengguo Li
IEEE Transactions on Industrial Electronics
3 Aug 2023
SERC
Institute of Microelectronics
A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres
Sajay Bhuvanendran Nair Gourikutty,
Lau Boon Long,
Seit Wen Wei,
Ming Chinq Jong,
David Soon Wee Ho,
Jiaqi Wu,
Teck Guan Lim,
Rathin Mandal,
Chong Ser Choong,
Chia Lai Yee,
Xin Li,
Jason Tsung-Yang Liow,
Surya Bhattacharya
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
3 Aug 2023
SERC
Institute of Microelectronics
High-Performance Amplifier Package Design for Heterogenous Integration on Si-interposer
Teck Guan Lim,
Lin Zho,
Sasi Kumar Tippabhotla,
Ji Lin,
Jong Ming Chinq,
Jiaqi Wu,
Tang Gongyue,
Eva Wai Leong Ching,
Yong Chyn Ng,
King Jien Chui,
Wei Jia Lu,
Chee Heng Goh,
Sek Lin Pek,
Jun Wei Agnes Loh
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
5 Jan 2022
SERC
Institute of Microelectronics
Towards Heterogeneous Integrated Electronic-Photonic Packages for Hyperscale Data Centers
Sajay Bhuvanendran Nair Gourikutty,
Ming Chinq Jong,
Chockanathan Vinoth Kanna,
David Soon Wee Ho,
Jiaqi Wu,
Rathin Mandal,
Nanxi Li,
Teck Guan Lim,
Jason Tsung-Yang Liow,
Surya Bhattacharya
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
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