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17 Jun 2026
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SERC
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Institute of Microelectronics
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Process Development of Two-Stacked Chips with a Backside Embedded Two-Phase Cooling Solution (Pending publish)
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Xiaowu Zhang,
Boon Long Lau,
Huicheng Feng,
Gongyue Tang,
Ming Chinq Jong,
Surya Bhattacharya,
Vempati Srinivasa Rao,
B.S.S. Chandra Rao,
Tran Van Nhat Anh
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2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
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24 Feb 2026
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SERC
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Institute of Microelectronics
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Two-Phase Liquid Cooling With Backside-Embedded Micro-Pin Fins for High-Power Microelectronics (Pending publish)
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Huicheng Feng,
Gongyue Tang,
Xiaowu Zhang,
Boon Long Lau,
Ming Chinq Jong
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2025 IEEE 27th Electronics Packaging Technology Conference (EPTC)
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12 Nov 2025
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SERC
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Institute of Microelectronics
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Two-phase Liquid Cooling of Vertically Stacked High-Power Chips with Backside-Embedded Micro-Pin Fins
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Huicheng Feng,
Gongyue Tang,
Xiaowu Zhang,
Boon Long Lau,
Ming Chinq Jong
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IEEE Transactions on Components, Packaging and Manufacturing Technology
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26 Jun 2025
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SERC
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Institute of Microelectronics
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Development of an Embedded 2-Phase Cooling Solution for Two Stacked High-Power Chips in Future HPC HPC and AI Applications (Pending publish)
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Xiaowu Zhang,
Huicheng Feng,
Gongyue Tang,
Boon Long Lau,
Ming Chinq Jong,
Surya Bhattacharya,
Vempati Srinivasa Rao
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2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
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7 Nov 2024
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SERC
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Institute of Microelectronics
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1.6 Tbps FOWLP-Based Silicon Photonic Engine for Co-Packaged Optics
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Xin Li,
Sajay Bhuvanendran Nair Gourikutty,
Jiaqi Wu,
Teck Guan Lim,
Pengfei Guo,
Jaye Charles Davies,
Edward Sing Chee Koh,
Boon Long Lau,
Ming Chinq Jong,
Ser Choong Chong,
San Sandra,
Chao Li,
Guo-Qiang Lo,
Surya Bhattacharya,
Jason Tsung-Yang Liow
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Journal of Lightwave Technology
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26 Jun 2024
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SERC
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Institute of Microelectronics
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Embedded Liquid Cooling of High-Power Microelectronics Using Liquid Metal
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Huicheng Feng,
Bin He,
Gongyue Tang,
Xiaowu Zhang,
Boon Long Lau,
Keng Yuen Jason Au,
Jun Wei Javier Ong,
Ming Chinq Jong
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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26 Jun 2024
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SERC
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Institute of Microelectronics
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A Compact Wafer-Level Heterogeneously Integrated Scalable Optical Transceiver for Data Centers
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Sajay Bhuvanendran Nair Gourikutty,
Jiaqi Wu,
Teck Guan Lim,
San Sandra,
Ming Chinq Jong,
Chia Lai Yee,
Lau Boon Long,
David Soon Wee Ho,
Chong Ser Choong,
Ding Liang,
Xiaoguang Tu,
Wanjun Wang,
Chee-Keong Tan,
Alison See,
Hsiu-Che Wang,
Roberto Coccioli,
Ronson Tan,
Radhakrishnan Nagarajan,
Surya Bhattacharya
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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28 Feb 2024
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SERC
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Institute of Microelectronics
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Two-Phase Liquid Cooling for High-Power Microelectronics via Embedded Micro-Pin Fin Heat Sink
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Huicheng Feng,
Gongyue Tang,
Xiaowu Zhang,
Boon Long Lau,
Ming Chinq Jong,
Keng Yuen Jason Au,
Jun Wei Javier Ong,
King Jien Chui,
Jun LI,
Hongying Li,
Duc Vinh Le,
Jing Lou
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IEEE Transactions on Components, Packaging and Manufacturing Technology
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3 Aug 2023
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SERC
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Institute of Microelectronics
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A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres
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Sajay Bhuvanendran Nair Gourikutty,
Lau Boon Long,
Seit Wen Wei,
Ming Chinq Jong,
David Soon Wee Ho,
Jiaqi Wu,
Teck Guan Lim,
Rathin Mandal,
Chong Ser Choong,
Chia Lai Yee,
Xin Li,
Jason Tsung-Yang Liow,
Surya Bhattacharya
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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3 Aug 2023
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SERC
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Institute of Microelectronics
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Embedded Micro-Pin Fin Heat Sink of Two-Phase Liquid Cooling for High Heat Flux 3D ICs
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Huicheng Feng,
Gongyue Tang,
Xiaowu Zhang,
Boon Long Lau,
Ming Chinq Jong,
Keng Yuen Jason Au,
King Jien Chui,
Jing Lou,
Hongying Li,
Duc Vinh Le
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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