| Publication date | Communities | Collections | Article title | Author(s) | Journal/Conference |
|---|---|---|---|---|---|
| 28 Feb 2024 | SERC | Institute of Microelectronics | Two-Phase Liquid Cooling for High-Power Microelectronics via Embedded Micro-Pin Fin Heat Sink | Huicheng Feng, Gongyue Tang, Xiaowu Zhang, Boon Long Lau, Ming Chinq Jong, Keng Yuen Jason Au, Jun Wei Javier Ong, King Jien Chui, Jun LI, Hongying Li, Duc Vinh Le, Jing Lou | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| 3 Aug 2023 | SERC | Institute of Microelectronics | Embedded Micro-Pin Fin Heat Sink of Two-Phase Liquid Cooling for High Heat Flux 3D ICs | Huicheng Feng, Gongyue Tang, Xiaowu Zhang, Boon Long Lau, Ming Chinq Jong, Keng Yuen Jason Au, King Jien Chui, Jing Lou, Hongying Li, Duc Vinh Le | 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) |