Embedded Micro-Pin Fin Heat Sink of Two-Phase Liquid Cooling for High Heat Flux 3D ICs

Page view(s)
17
Checked on Nov 11, 2024
Embedded Micro-Pin Fin Heat Sink of Two-Phase Liquid Cooling for High Heat Flux 3D ICs
Title:
Embedded Micro-Pin Fin Heat Sink of Two-Phase Liquid Cooling for High Heat Flux 3D ICs
Journal Title:
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
Keywords:
Publication Date:
03 August 2023
Citation:
Feng, H., Tang, G., Zhang, X., Lau, B. L., Jong, M. C., Au, K. Y. J., Chui, K. J., Lou, J., Li, H., & Le, D. V. (2023, May). Embedded Micro-Pin Fin Heat Sink of Two-Phase Liquid Cooling for High Heat Flux 3D ICs. 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC). https://doi.org/10.1109/ectc51909.2023.00337
Abstract:
This paper presents a novel two-phase liquid cooling solution of high-power integrated circuit (IC) chips using embedded micro-pin fin heat sink (MPFHS). A titanium thin film heater and two resistance temperature detectors (RTDs) are deposited on the active surface of a silicon chip, to simulate the functional dice and measure chip temperature, respectively. The backside surface of silicon chip is etched to form the embedded MPFHS, and then bonded to a silicon cap. Printed circuit board (PCB) is designed and fabricated to power the heater and collect signals from RTDs. The coolant (deionized water) is fed and collected through the thin side openings of the chip. Manifolds are 3D printed with stainless steel to properly match the openings. Experimental setup of two-phase liquid cooling loop is built for testing and characterization. A wide range of coolant flowrate and heat flux of heater is tested. Heat flux up to 188 W/cm2 is achieved with small coolant flowrates experimentally. Chip temperature and temperature gradient linearly increase as heat flux increases, which can be reduced by increasing coolant flowrate. In two-phase regime, chip temperature and pressures at inlet and outlet are highly fluctuated, which is not preferable in chip cooling. Further investigations are to be carried out for a more stable cooling.
License type:
Publisher Copyright
Funding Info:
This research is supported by core funding from: IME
Grant Reference no. : C210415009
Description:
© 2023 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
ISSN:
2377-5726
Files uploaded:

File Size Format Action
post-print-embedded-micro-pin-fin-heat-sink-of-two-phase-liquid-cooling-for-high-heat-flux-3d-ics.pdf 472.16 KB PDF Request a copy