Feng, H., Tang, G., Zhang, X., Lau, B. L., & Jong, M. C. (2025). Two-phase Liquid Cooling of Vertically Stacked High-Power Chips with Backside-Embedded Micro-Pin Fins. IEEE Transactions on Components, Packaging and Manufacturing Technology, 1–1. https://doi.org/10.1109/tcpmt.2025.3631836
Abstract:
Three-dimensional integrated circuits (3D ICs) enable a higher level of device integration for high-performance computing but also introduce significant thermal challenges due to increased power density. This letter demonstrates a two-phase liquid cooling approach for stacked high-power chips featuring backside-embedded micro-pin fins. Deionized water is circulated directly through the chips, providing internal cooling. The results show effective thermal management, with maximum power levels of 126 W and 140 W achieved for Chip 1 and Chip 2, respectively. Temperature fluctuations in the two-phase regime remain minimal, confirming the approach’s practicality. Chip 2 benefits from lower temperatures and higher heat transfer coefficients due to double-side cooling by water flowing through both itself and Chip 1. Increasing the flowrate reduces the chip temperatures and improves heat transfer coefficients but incurs higher pressure drops. The coefficient of performance decreases with flowrate but improves with heat power. These findings validate the feasibility of the proposed cooling method and establish a proof of concept for further integration in 3D IC designs.
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Funding Info:
This research / project is supported by the Agency for Science, Technology and Research, Singapore - Council Strategic Fund
Grant Reference no. : C210415009
This research / project is supported by the Agency for Science, Technology and Research, Singapore - Applied Centre of Excellence in Advanced Packaging 3.0
Grant Reference no. : I2101E0008