Citation:
Feng, H., Tang, G., Zhang, X., Lau, B. L., Jong, M. C., Au, K. Y. J., Ong, J. W. J., Chui, K. J., Li, J., Li, H., Vinh Le, D., & Lou, J. (2024). Two-Phase Liquid Cooling for High-Power Microelectronics via Embedded Micro-Pin Fin Heat Sink. IEEE Transactions on Components, Packaging and Manufacturing Technology, 14(3), 397–405. https://doi.org/10.1109/tcpmt.2024.3371390