Two-Phase Liquid Cooling for High-Power Microelectronics via Embedded Micro-Pin Fin Heat Sink

Two-Phase Liquid Cooling for High-Power Microelectronics via Embedded Micro-Pin Fin Heat Sink

IEEE Transactions on Components, Packaging and Manufacturing Technology

10.1109/TCPMT.2024.3371390

http://dx.doi.org/10.1109/tcpmt.2024.3371390

Huicheng Feng, Gongyue Tang, Xiaowu Zhang, Boon Long Lau, Ming Chinq Jong, Keng Yuen Jason Au, Jun Wei Javier Ong, King Jien Chui, Jun LI, Hongying Li, Duc Vinh Le, Jing Lou

28 February 2024

Feng, H., Tang, G., Zhang, X., Lau, B. L., Jong, M. C., Au, K. Y. J., Ong, J. W. J., Chui, K. J., Li, J., Li, H., Vinh Le, D., & Lou, J. (2024). Two-Phase Liquid Cooling for High-Power Microelectronics via Embedded Micro-Pin Fin Heat Sink. IEEE Transactions on Components, Packaging and Manufacturing Technology, 14(3), 397–405. https://doi.org/10.1109/tcpmt.2024.3371390

Two-phase liquid cooling can achieve significantly high heat flux and is therefore a key method for heat dissipation of high-power microelectronics. In this study, we develop an embedded two-phase liquid cooling solution with micro-pin fins embedded in a thermal test vehicle. We conduct experimental tests under various coolant (deionized water) flowrates and heat fluxes. Heat fluxes up to 181 W/cm2 (heat power 181 W) are achieved at small coolant flowrates. Chip temperature and pressure in the two-phase regime are fluctuated. By degassing the coolant prior to experimental testing, the chip temperature fluctuation span can be reduced to as low as 7.6◦C. The pressure fluctuation is also greatly reduced. These results are beneficial for the practical application of two-phase liquid cooling in microelectronics, where chip temperature fluctuations may damage chips due to temporary overheating. In addition, the temperature and temperature gradient of chip linearly increase with increasing heat flux. They both can be reduced by increasing coolant flowrate. As coolant flowrate increases, the heat flux at which two-phase cooling occurs also increases. The present results demonstrate the effectiveness of embedded two-phase liquid cooling, which can facilitate our next step to develop embedded two-phase liquid cooling for true 3D ICs (i.e., two-layer stacked chips).

Publisher Copyright

This research / project is supported by the Agency for Science Technology and Research, Singapore (A*STAR) - Council Strategic Fund
Grant Reference no. : C210415009

© 2024 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.

https://oar.a-star.edu.sg/communities-collections/articles/19823

2156-3985
2156-3950

Institute of Microelectronics