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Publication date Communities Collections Article title Author(s) Journal/Conference
17 Jun 2026 SERC Institute of Microelectronics Process Development of Two-Stacked Chips with a Backside Embedded Two-Phase Cooling Solution Xiaowu Zhang, Boon Long Lau, Huicheng Feng, Gongyue Tang, Ming Chinq Jong, Surya Bhattacharya, Vempati Srinivasa Rao, B.S.S. Chandra Rao, Tran Van Nhat Anh 2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
26 Jun 2025 SERC Institute of Microelectronics Process Development, Challenges, and Strategies for Void-Free Multi-Chip Stacking in Hybrid Bonding Applications Ser Choong Chong, Ling Xie, Vasarla Nagendra Sekhar, Mishra Dileep Kumar, B.S.S. Chandra Rao, Vempati Srinivasa Rao 2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
26 Jun 2024 SERC Institute of Microelectronics Process Challenges in Thin Wafers Fabrication with Double Side Hybrid Bond Pads for Chip Stacking Mishra Dileep Kumar, Vasarla Nagendra Sekhar, B.S.S. Chandra Rao, Ser Choong Chong, Vempati Srinivasa Rao 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
3 Aug 2023 SERC Institute of Microelectronics Laser integration on a photonic integrated circuit with high alignment accuracy for data transmission Ting Ta Chi, Zhenyu Li, Nanxi Li, Hong Cai, Y M Tobing Landobasa, Haitao Yu, Senthilkumar Darshini, Jae Ok Yoo, Arvind Sundaram, B.S.S. Chandra Rao, Lennon Y. T. Lee, Wen Lee 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
27 Jul 2023 SERC Institute of Microelectronics Laser Integration on Photonic Integrated Circuit for High Bandwidth Data Transmission Nanxi Li, Ting-Ta Chi, Landobasa Y M Tobing, Zhenyu Li, Hong Cai, Haitao Yu, Yoo Jae Ok, B.S.S. Chandra Rao, Lennon Y. T. Lee, Wen Lee CLEO 2023
5 Jan 2022 SERC Institute of Microelectronics Silicon Isolation Trench Integration for the 4-stack Memory Wafer Xiangyu Wang, Masaya Kawano, B.S.S. Chandra Rao 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)