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17 Jun 2026
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SERC
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Institute of Microelectronics
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Process Development of Two-Stacked Chips with a Backside Embedded Two-Phase Cooling Solution (Pending publish)
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Xiaowu Zhang,
Boon Long Lau,
Huicheng Feng,
Gongyue Tang,
Ming Chinq Jong,
Surya Bhattacharya,
Vempati Srinivasa Rao,
B.S.S. Chandra Rao,
Tran Van Nhat Anh
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2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
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17 Jun 2026
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SERC
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Institute of Microelectronics
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Process Optimization for Chip-to-Wafer Hybrid Bonding Using Inter-Die Gap Fill Integration Approach (Pending publish)
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Mishra Dileep Kumar,
Vasarla Nagendra Sekhar,
Sasi Kumar Tippabhotla,
Hipona Randy Tupaen,
Norhanani Jaafar,
B.S.S. Chandra Rao,
Daniel Ismael,
Xie Ling,
Ser Choong Chong,
Vempati Srinivasa Rao
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2026 IEEE 76th Electronic Components and Technology Conference (ECTC)
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26 Jun 2025
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SERC
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Institute of Microelectronics
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Addressing Key Process Challenges in Developing High Aspect Ratio TSVs up to 15 with 1 μm Critical Dimension (Pending publish)
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Tran Van Nhat Anh,
Nandini Venkataraman,
Ya-Ching Tseng,
Arvind Sundaram,
Binni Varghese,
Heng Zeng Wei,
B.S.S. Chandra Rao
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2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
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26 Jun 2025
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SERC
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Institute of Microelectronics
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Process Development, Challenges, and Strategies for Void-Free Multi-Chip Stacking in Hybrid Bonding Applications (Pending publish)
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Ser Choong Chong,
Ling Xie,
Vasarla Nagendra Sekhar,
Mishra Dileep Kumar,
B.S.S. Chandra Rao,
Vempati Srinivasa Rao
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2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
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26 Jun 2025
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SERC
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Institute of Microelectronics
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Warpage Engineering in C2W Hybrid Bonding Using Inter-Die Gap Fill Dielectrics for 2.5D/3D Integration (Pending publish)
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Mishra Dileep Kumar,
Vasarla Nagendra Sekhar,
Xie Ling,
Cheemalamarri Hemanth Kumar,
Sasi Kumar Tippabhotla,
B.S.S. Chandra Rao,
Hipona Randy Tupaen,
Ser Choong Chong,
Vempati Srinivasa Rao
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2025 IEEE 75th Electronic Components and Technology Conference (ECTC)
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26 Jun 2024
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SERC
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Institute of Microelectronics
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Process Challenges in Thin Wafers Fabrication with Double Side Hybrid Bond Pads for Chip Stacking
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Mishra Dileep Kumar,
Vasarla Nagendra Sekhar,
B.S.S. Chandra Rao,
Ser Choong Chong,
Vempati Srinivasa Rao
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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3 Aug 2023
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SERC
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Institute of Microelectronics
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Laser integration on a photonic integrated circuit with high alignment accuracy for data transmission
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Ting Ta Chi,
Zhenyu Li,
Nanxi Li,
Hong Cai,
Y M Tobing Landobasa,
Haitao Yu,
Senthilkumar Darshini,
Jae Ok Yoo,
Arvind Sundaram,
B.S.S. Chandra Rao,
Lennon Y. T. Lee,
Wen Lee
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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27 Jul 2023
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SERC
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Institute of Microelectronics
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Laser Integration on Photonic Integrated Circuit for High Bandwidth Data Transmission
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Nanxi Li,
Ting-Ta Chi,
Landobasa Y M Tobing,
Zhenyu Li,
Hong Cai,
Haitao Yu,
Yoo Jae Ok,
B.S.S. Chandra Rao,
Lennon Y. T. Lee,
Wen Lee
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CLEO 2023
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5 Jan 2022
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SERC
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Institute of Microelectronics
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Silicon Isolation Trench Integration for the 4-stack Memory Wafer
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Xiangyu Wang,
Masaya Kawano,
B.S.S. Chandra Rao
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2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
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