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Publication date Communities Collections Article title Author(s) Journal/Conference
5 Jan 2022 SERC Institute of Microelectronics Wafer-to-Wafer Hybrid Bonding Challenges for 3D IC Applications H. Y. Li, Hong Miao Ji, Alfred Neo Siang Kiat, Masaya Kawano 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Thermal Effect Investigation of Chip-to-Wafer Hybrid Bonding on 3D-Stacked Memory Yong Han, Masaya Kawano 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Silicon Isolation Trench Integration for the 4-stack Memory Wafer Xiangyu Wang, Masaya Kawano, B.S.S. Chandra Rao 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5 Jan 2022 SERC Institute of Microelectronics Numerical study on wafer level warpage evolution during chip to wafer hybrid bonding process Lin Ji, Masaya Kawano, Sasi Kumar Tippabhotla, Woon Leng Loh 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
10 Aug 2021 SERC Institute of Microelectronics One-step TSV process development for 4-layer wafer stacked DRAM Masaya Kawano, Xiang-Yu Wang, Qin Ren, Woon-Leng Loh, BSS. Chandra Rao, King-Jien Chui 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
10 Aug 2021 SERC Institute of Microelectronics Dielectric Materials Characterization for Hybrid Bonding Vivek Chidambaram, Prayudi Lianto, Xiangyu Wang, Gilbert See, Nicholas Wiswell, Masaya Kawano 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
12 May 2021 SERC Institute of Microelectronics Technology Trends in 2.5D/3D Packaging and Heterogeneous Integration Masaya Kawano 2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
1 Nov 2017 SERC Institute of Microelectronics Study on Low Warpage and High Reliability for Large Package Using TSV-Free Interposer Technology Through SMART Codesign Modeling Mian Zhi Ding, Yong Han, Surya Bhattacharya, Fa Xing Che, Masaya Kawano IEEE Transactions on Components, Packaging and Manufacturing Technology